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IKW40N65F5FKSA1

Infineon Technologies

IKW40N65F5FKSA1 by Infineon Technologies

IKW40N65F5FKSA1 by Infineon is an N-CHANNEL IGBT with VCEsat of 2.1V, IC of 74A, and Pmax of 250W. Ideal for POWER CONTROL applications due to its fast turn-off time (toff) of 200ns and high operating temperature range (-40 to 175°C). Package style: FLANGE MOUNT.

Median Price

$3.200

Lifecycle Status

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20

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1k+

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$0.850

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$0.850

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Chip1Stop

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$1.730

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$1.730

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Arrow

USA . 1 parts In-Stock

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$2.642

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$2.267

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$1.894

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1

$2.642

$2.267

$1.894

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Farnell

UK . 181 parts In-Stock

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$3.530

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$1.900

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$1.570

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181

$3.530

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$1.570

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RS Americas

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$4.040

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$3.040

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$2.630

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5

$4.040

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Element14

Singapore . 30 parts In-Stock

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$4.199

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$2.406

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$2.391

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30

$4.199

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$2.391

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Mouser Electronics

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$4.550

100+ parts

$2.090

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$1.850

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1,673

$4.550

$2.090

$1.850

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DigiKey

USA . 614 parts In-Stock

1+ parts

$4.550

100+ parts

$2.527

1k+ parts

$1.753

10k+ parts

$1.613

614

$4.550

$2.527

$1.753

$1.613

Newark

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$5.040

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$2.700

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$2.550

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50

$5.040

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Future Electronics

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$2.870

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$2.820

720

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$2.870

$2.820

Verical

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$1.928

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$1.790

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$1.530

60

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$1.928

$1.790

$1.530

Rochester

USA . 1 parts In-Stock

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$1.620

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$1.450

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$1.360

1

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Digiode

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$1.872

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Nova Conductors

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50

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TME

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$3.890

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$2.150

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$3.890

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$4.051

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$2.837

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$4.051

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Vyrian

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IBS Electronics

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$3.562

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$2.216

720

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Rutronik

Germany . 210 parts In-Stock

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$2.270

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$2.060

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210

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$2.270

$2.060

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Elcom Components

USA . 100 parts In-Stock

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100

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Ampacity Inc.

Singapore . 578 parts In-Stock

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$1.550

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578

$1.550

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Semicontronic

India . 164 parts In-Stock

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$1.550

100+ parts

$1.511

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$1.504

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164

$1.550

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$1.504

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Corohmni

South Africa . 32 parts In-Stock

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$1.728

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$1.728

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Aztec Data Supply Inc.

USA . 83 parts In-Stock

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$1.760

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$1.760

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Corphita

USA . 158 parts In-Stock

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$1.773

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$1.773

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Modulus Dynamics

Lithuania . 23,479 parts In-Stock

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$1.908

100+ parts

$1.832

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$1.755

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23,479

$1.908

$1.832

$1.755

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Allen Electronics Distributors

USA . 5 parts In-Stock

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$2.670

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$2.670

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Argo Parts USA

USA . 1,045 parts In-Stock

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$3.010

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Component Stockers USA

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$2.300

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$2.120

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5,983

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Continental Prestige Electronics

USA . 96 parts In-Stock

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$4.550

100+ parts

$2.560

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$2.160

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96

$4.550

$2.560

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Microchip USA

USA . 2,157 parts In-Stock

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$15.540

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2,157

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Glotronic Ltd.

UK . 2,453 parts In-Stock

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2,453

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Netroflash

USA . 2,000 parts In-Stock

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$3.077

1k+ parts

$2.983

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$2.920

2,000

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$3.077

$2.983

$2.920

Perfect Parts

USA . 554 parts In-Stock

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554

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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GreenTree Electronics

Israel . 240 parts In-Stock

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240

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iodParts Technologies Inc.

India . 222 parts In-Stock

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$4.459

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222

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$4.459

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Overview

Unlock the power of technology with the IKW40N65F5FKSA1 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBTs) that are perfect for power control applications. With a maximum operating temperature of 175°C and a maximum VCEsat of 2.1V, this N-channel transistor offers unparalleled performance and reliability. Say goodbye to overheating and hello to seamless power management with the IKW40N65F5FKSA1. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this IGBT lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses and faster switching speeds, making them suitable for high-speed power control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in reducing circuit complexity and overall cost, making this IGBT a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT ensures efficient and reliable performance in controlling power systems.

Maximum VCEsat: 2.1 V

The low VCEsat value of 2.1 V reduces power dissipation and improves overall efficiency in power control operations.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and installation, making it convenient for integration into different systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and ensures secure connections, enhancing the overall reliability of the IGBT.

Nominal Turn Off Time (toff): 200 ns

With a fast turn-off time of 200 ns, this IGBT enables precise control of power output, making it suitable for dynamic power control applications.

No. of Terminals: 3

The 3 terminals allow for easy connection and integration into existing circuitry, enhancing the versatility of this IGBT.

Maximum Power Dissipation (Abs): 250 W

The high maximum power dissipation capability of 250 W ensures reliable operation even under high power loads.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation, making this IGBT suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this IGBT can withstand high-temperature environments, ensuring stable performance.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage of 650 V allows for handling of high voltage levels, making this IGBT suitable for power control in various systems.

Transistor Element Material: SILICON

The silicon material used in the transistor element ensures high reliability, stability, and performance in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating of 20 V ensures safe and reliable operation in controlling power systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this IGBT can operate in extreme cold conditions, making it versatile for different environments.

Maximum Collector Current (IC): 74 A

The high maximum collector current rating of 74 A allows for handling high currents, making this IGBT suitable for power control in high-power circuits.

Maximum Gate-Emitter Threshold Voltage: 4.8 V

The maximum gate-emitter threshold voltage of 4.8 V ensures precise control and switching of the IGBT, enhancing its performance in power control applications.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures reliable connections, increasing the durability and longevity of this IGBT.

Terminal Position: SINGLE

The single terminal position simplifies the wiring and connection process, making this IGBT easy to install and integrate into different systems.

Nominal Turn On Time (ton): 34 ns

With a fast turn-on time of 34 ns, this IGBT enables quick response and efficient power control, making it suitable for dynamic power management applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N65F5FKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

200 ns

Nominal Turn On Time (ton):

34 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKW40N65F5FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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