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FGH40N60UFTU

Onsemi

FGH40N60UFTU by Onsemi

FGH40N60UFTU by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and max collector current of 80A. It has a power dissipation of 290W, making it suitable for power control applications. With a turn-off time of 190ns and turn-on time of 110ns, it offers efficient switching performance in various industrial settings.

Median Price

$2.060

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 163 parts In-Stock

1+ parts

$2.060

100+ parts

$1.940

1k+ parts

$1.750

10k+ parts

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163

$2.060

$1.940

$1.750

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Distributors (In-Stock)

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Digiode

USA . 1,754 parts In-Stock

1+ parts

$1.957

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-

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1,754

$1.957

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.529

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200

$2.529

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Chip Stock

USA . 7,300 parts In-Stock

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7,300

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Vyrian

USA . 2,354 parts In-Stock

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2,354

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Distributors (Availability)

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Ampacity Inc.

Singapore . 29 parts In-Stock

1+ parts

$1.750

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-

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29

$1.750

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Aztec Data Supply Inc.

USA . 22,722 parts In-Stock

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$1.760

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22,722

$1.760

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Corphita

USA . 2,504 parts In-Stock

1+ parts

$1.854

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2,504

$1.854

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Corohmni

South Africa . 83 parts In-Stock

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$2.060

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83

$2.060

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$2.478

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$2.379

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2,000

$2.478

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$2.379

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Continental Prestige Electronics

USA . 4,947 parts In-Stock

1+ parts

$2.529

100+ parts

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$2.478

4,947

$2.529

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$2.478

Argo Parts USA

USA . 831 parts In-Stock

1+ parts

$2.529

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831

$2.529

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AZTECH Wire

Italy . 448 parts In-Stock

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$18.305

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448

$18.305

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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TANS Electronics

Latvia . 3,429 parts In-Stock

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3,429

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Problanco Electronics

Mexico . 1,715 parts In-Stock

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Supply Digital

USA . 1,434 parts In-Stock

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1,434

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Kulean Microsystems

USA . 989 parts In-Stock

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989

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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938

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SupplyDigital Components

Austria . 928 parts In-Stock

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928

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Overview

Boost your power control applications with the FGH40N60UFTU Insulated Gate Bipolar Transistor from Onsemi. Designed with quality and reliability in mind, this N-CHANNEL transistor offers a single configuration with a built-in diode, making it ideal for various power control needs. With a maximum operating temperature of 150°C and a collector-emitter voltage of 600V, this transistor delivers exceptional performance and efficiency. Upgrade your projects today with the FGH40N60UFTU and experience the difference in power and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode helps in controlling reverse currents and simplifies circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance.

Maximum Fall Time (tf): 100 ns

Fast fall time ensures efficient switching and reduces power loss.

Nominal Turn Off Time (toff): 190 ns

Relatively low turn off time helps in quick switching, improving overall performance.

No. of Terminals: 3

Simple and easy to use with a limited number of terminals for connections.

Maximum Power Dissipation (Abs): 290 W

High power dissipation capability allows for handling heavy loads without overheating.

Maximum Operating Temperature: 150 °C

Withstands high temperatures, making it suitable for various industrial applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating ensures reliability and safety in high voltage circuits.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating for proper control and signal handling.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling heavy loads and high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Proper gate-emitter threshold voltage ensures accurate switching and control.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and durable terminal connection.

Terminal Position: SINGLE

Single terminal position makes it easy to connect and integrate into circuits.

Case Connection: COLLECTOR

Collector case connection for easy and efficient thermal management.

Nominal Turn On Time (ton): 110 ns

Fast turn on time ensures quick response and efficient switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60UFTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

100 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

190 ns

Nominal Turn On Time (ton):

110 ns

Trade Compliance

FGH40N60UFTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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