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FGH40N60SMDF_F085

Onsemi

FGH40N60SMDF_F085 by Onsemi

FGH40N60SMDF_F085 by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 80A IC, and 349W power dissipation. Ideal for power control applications due to its single configuration with built-in diode. Operates in temperatures ranging from -55°C to 175°C, making it suitable for various industrial uses.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$2.720

1k+ parts

$2.430

10k+ parts

$2.290

13

-

$2.720

$2.430

$2.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 584 parts In-Stock

1+ parts

$2.565

100+ parts

-

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-

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584

$2.565

-

-

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Digiode

USA . 2,816 parts In-Stock

1+ parts

$2.888

100+ parts

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2,816

$2.888

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Vyrian

USA . 2,421 parts In-Stock

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2,421

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 213 parts In-Stock

1+ parts

$1.827

100+ parts

-

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213

$1.827

-

-

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Argo Parts USA

USA . 6,801 parts In-Stock

1+ parts

$2.565

100+ parts

-

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6,801

$2.565

-

-

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Continental Prestige Electronics

USA . 2,426 parts In-Stock

1+ parts

$2.565

100+ parts

-

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-

10k+ parts

$2.514

2,426

$2.565

-

-

$2.514

Ampacity Inc.

Singapore . 26 parts In-Stock

1+ parts

$2.580

100+ parts

-

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-

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-

26

$2.580

-

-

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Semicontronic

India . 13 parts In-Stock

1+ parts

$2.580

100+ parts

$2.516

1k+ parts

$2.503

10k+ parts

-

13

$2.580

$2.516

$2.503

-

Corphita

USA . 3,714 parts In-Stock

1+ parts

$2.736

100+ parts

-

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3,714

$2.736

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Corohmni

South Africa . 636 parts In-Stock

1+ parts

$3.040

100+ parts

-

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636

$3.040

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AZTECH Wire

Italy . 1,135 parts In-Stock

1+ parts

$15.952

100+ parts

-

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1,135

$15.952

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QUARKTWIN TECHNOLOGY LTD

USA . 14,803 parts In-Stock

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14,803

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TANS Electronics

Latvia . 11,240 parts In-Stock

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11,240

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Kulean Microsystems

USA . 8,518 parts In-Stock

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8,518

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Problanco Electronics

Mexico . 6,428 parts In-Stock

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6,428

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SupplyDigital Components

Austria . 5,884 parts In-Stock

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5,884

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.514

1k+ parts

$2.437

10k+ parts

$2.385

2,000

-

$2.514

$2.437

$2.385

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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710

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Supply Digital

USA . 418 parts In-Stock

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418

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Elevate your power control applications with the FGH40N60SMDF_F085 by Onsemi, a high-quality Insulated Gate Bipolar Transistor (IGBT) designed for efficiency and reliability. With a single configuration and built-in diode, this transistor offers seamless performance in a variety of settings. From its maximum operating temperature of 175°C to its low VCEsat of 2.5V, this product delivers unmatched value and benefits to customers seeking optimal power control solutions. Trust Onsemi's expertise and innovation to enhance your projects with the FGH40N60SMDF_F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Allows for better power control and efficiency in applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design and installation process, making it easier to use in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in such scenarios.

Maximum VCEsat: 2.5 V

Low VCEsat ensures minimal power loss and high efficiency in power control operations.

Package Shape: RECTANGULAR

Compact and space-saving design for easy integration into different systems.

Terminal Form: THROUGH-HOLE

Ensures secure and reliable connections for stable operation.

Maximum Power Dissipation (Abs): 349 W

Capable of handling high power levels, suitable for demanding applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range for versatility in various environments.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating for handling higher voltages in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage for efficient switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60SMDF_F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

20 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

123 ns

Nominal Turn On Time (ton):

50 ns

Maximum VCEsat:

2.5 V

Trade Compliance

FGH40N60SMDF_F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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