Loading...

FGH40T120SMDL4

Onsemi

FGH40T120SMDL4 by Onsemi

FGH40T120SMDL4 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.4V and a max IC of 80A. Ideal for power control applications, it has a package style of FLANGE MOUNT and can operate in temperatures ranging from -55 to 175 °C.

Median Price

$5.542

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.542

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$5.542

-

-

-

Chip Stock

USA . 6,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,420

-

-

-

-

Digiode

USA . 1,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,930

-

-

-

-

Vyrian

USA . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

472

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,069 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

$0.050

-

-

-

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$0.560

-

-

-

Aztec Data Supply Inc.

USA . 1,377 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

$1.026

-

-

-

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$2.217

100+ parts

$2.017

1k+ parts

$1.818

10k+ parts

-

550

$2.217

$2.017

$1.818

-

Continental Prestige Electronics

USA . 6,698 parts In-Stock

1+ parts

$5.542

100+ parts

-

1k+ parts

-

10k+ parts

$5.431

6,698

$5.542

-

-

$5.431

AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$15.368

100+ parts

-

1k+ parts

-

10k+ parts

-

472

$15.368

-

-

-

Semicontronic

India . 965 parts In-Stock

1+ parts

$59.050

100+ parts

$57.574

1k+ parts

$57.278

10k+ parts

-

965

$59.050

$57.574

$57.278

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,173

-

-

-

-

Problanco Electronics

Mexico . 6,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,954

-

-

-

-

SupplyDigital Components

Austria . 5,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,197

-

-

-

-

Kulean Microsystems

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,485

-

-

-

-

Supply Digital

USA . 2,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,874

-

-

-

-

Corphita

USA . 2,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,347

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

859

-

-

-

-

Argo Parts USA

USA . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

748

-

-

-

-

TANS Electronics

Latvia . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

Perfect Parts

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

504

-

-

-

-

Overview

Elevate your power control needs with the FGH40T120SMDL4 by Onsemi. As a leader in insulated gate bipolar transistors (IGBT), Onsemi delivers top-notch quality and reliability. Whether you're looking to optimize power efficiency or enhance performance, this single-channel transistor with built-in diode is the perfect solution. From industrial applications to renewable energy systems, trust the FGH40T120SMDL4 to provide the value, benefits, and advantages you need to elevate your projects to new heights. Choose Onsemi for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency and performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode saves space and reduces the need for additional components.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling power.

Maximum VCEsat: 2.4 V

Low saturation voltage helps in reducing power losses and increasing efficiency.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy installation and integration into various systems.

Nominal Turn Off Time (toff): 542 ns

Fast turn-off time enhances switching speed and efficiency in power control applications.

Maximum Power Dissipation (Abs): 555 W

High power dissipation capability enables the transistor to handle large power loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating makes it suitable for high-power applications.

Maximum Gate-Emitter Voltage: 25 V

Safe operating voltage range for the gate ensures protection against voltage spikes.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling of large current loads.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Optimal threshold voltage for efficient gate control in power applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

Simplified terminal configuration for easy installation and connection.

Nominal Turn On Time (ton): 90 ns

Fast turn-on time ensures quick response and switching in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40T120SMDL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

542 ns

Nominal Turn On Time (ton):

90 ns

Maximum VCEsat:

2.4 V

Trade Compliance

FGH40T120SMDL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20