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FP25R12W2T4PB11BPSA1

Infineon Technologies

FP25R12W2T4PB11BPSA1 by Infineon Technologies

Infineon's FP25R12W2T4PB11BPSA1 is an N-CHANNEL IGBT with 7 elements, max. collector current of 39A, and max. collector-emitter voltage of 1200V. Ideal for power control applications due to its complex configuration, fast turn-on time (47ns), and isolated case connection for high-power operations at up to 175°C.

Median Price

$53.675

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$58.800

100+ parts

-

1k+ parts

$43.870

10k+ parts

-

7

$58.800

-

$43.870

-

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$36.200

1k+ parts

$32.380

10k+ parts

$30.480

11

-

$36.200

$32.380

$30.480

DigiKey

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

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Verical

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$53.675

1k+ parts

$48.538

10k+ parts

-

11

-

$53.675

$48.538

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 603 parts In-Stock

1+ parts

$43.396

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$43.396

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$53.840

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$53.840

-

-

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Vyrian

USA . 8,577 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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8,577

-

-

-

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DigiKey Marketplace

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 17,252 parts In-Stock

1+ parts

$0.908

100+ parts

$0.872

1k+ parts

$0.835

10k+ parts

-

17,252

$0.908

$0.872

$0.835

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.713

100+ parts

$1.559

1k+ parts

$1.405

10k+ parts

-

600

$1.713

$1.559

$1.405

-

AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$10.161

100+ parts

-

1k+ parts

-

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881

$10.161

-

-

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Andel Nordic

Denmark . 5,042 parts In-Stock

1+ parts

$28.150

100+ parts

-

1k+ parts

$19.702

10k+ parts

$19.702

5,042

$28.150

-

$19.702

$19.702

Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$38.830

100+ parts

-

1k+ parts

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11

$38.830

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Corphita

USA . 977 parts In-Stock

1+ parts

$41.112

100+ parts

-

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977

$41.112

-

-

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Component Stockers USA

USA . 15 parts In-Stock

1+ parts

$50.770

100+ parts

-

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15

$50.770

-

-

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Continental Prestige Electronics

USA . 3,513 parts In-Stock

1+ parts

$53.840

100+ parts

-

1k+ parts

-

10k+ parts

$52.763

3,513

$53.840

-

-

$52.763

Microchip USA

USA . 2,980 parts In-Stock

1+ parts

$109.158

100+ parts

-

1k+ parts

-

10k+ parts

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2,980

$109.158

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-

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Argo Parts USA

USA . 3,358 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,358

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$52.763

1k+ parts

$51.148

10k+ parts

$50.071

100

-

$52.763

$51.148

$50.071

Overview

Discover the power of cutting-edge technology with the FP25R12W2T4PB11BPSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers high-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for power control applications. With a complex configuration and 7 elements, this N-CHANNEL transistor offers exceptional performance and reliability. Experience the benefits of quick turn-on time, efficient power management, and a maximum collector-emitter voltage of 1200V. Upgrade your systems with the FP25R12W2T4PB11BPSA1 and unleash its full potential for your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency, making them ideal for power control applications.

Configuration: COMPLEX

Complex configuration allows for enhanced performance and functionality, making this IGBT suitable for advanced power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient operation in high-power systems.

No. of Elements: 7

With 7 elements, this IGBT can handle complex power control tasks with precision and accuracy.

Nominal Turn Off Time (toff): 520 ns

The fast turn-off time of 520 ns allows for quick response and efficient power switching, reducing losses and improving performance.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating of 1200 V enables this IGBT to be used in high-voltage applications, providing robust performance and reliability.

Maximum Collector Current (IC): 39 A

With a high maximum collector current of 39 A, this IGBT can handle high-power loads with ease, ensuring stable operation under heavy loads.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W2T4PB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

520 ns

Nominal Turn On Time (ton):

47 ns

Trade Compliance

FP25R12W2T4PB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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