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FP25R12KT3BOSA1

Infineon Technologies

FP25R12KT3BOSA1 by Infineon Technologies

FP25R12KT3BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, ideal for POWER CONTROL applications. It features a max Collector-Emitter Voltage of 1200V, Nominal Turn Off Time of 610ns, and Max Collector Current of 40A. This RECTANGULAR package has 24 terminals and operates at a max temperature of 150°C.

Median Price

$55.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

-

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$55.630

1k+ parts

$49.780

10k+ parts

$46.850

7

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$55.630

$49.780

$46.850

DigiKey

USA . 7 parts In-Stock

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-

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7

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Distributors (In-Stock)

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Digiode

USA . 549 parts In-Stock

1+ parts

$58.872

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549

$58.872

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$89.230

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$89.230

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Vyrian

USA . 8,232 parts In-Stock

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DigiKey Marketplace

USA . 7 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 465 parts In-Stock

1+ parts

$1.118

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465

$1.118

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Modulus Dynamics

Lithuania . 21,208 parts In-Stock

1+ parts

$1.275

100+ parts

$1.224

1k+ parts

$1.173

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-

21,208

$1.275

$1.224

$1.173

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Aztec Data Supply Inc.

USA . 323 parts In-Stock

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$1.520

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323

$1.520

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AZTECH Wire

Italy . 297 parts In-Stock

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$16.137

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$16.137

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$52.670

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Corphita

USA . 886 parts In-Stock

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$55.773

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Aranea Global

USA . 2,000 parts In-Stock

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$87.445

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$83.948

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$87.445

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$83.948

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Continental Prestige Electronics

USA . 4,774 parts In-Stock

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$89.230

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$87.445

4,774

$89.230

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$87.445

Semicontronic

India . 7 parts In-Stock

1+ parts

$114.640

100+ parts

$111.774

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$111.201

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7

$114.640

$111.774

$111.201

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Microchip USA

USA . 6,301 parts In-Stock

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$136.827

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6,301

$136.827

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Argo Parts USA

USA . 422 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of innovation with the FP25R12KT3BOSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor offers superior performance in power control applications, boasting a complex configuration with 7 elements for maximum efficiency. With a maximum collector-emitter voltage of 1200V and a nominal turn off time of 610ns, this product is designed to meet your high-demand needs. Trust Infineon for reliable, cutting-edge technology that brings value and benefits to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them suitable for power control applications.

Configuration: COMPLEX

Complex configuration allows for better control and optimization of power flow, ideal for power control applications requiring high performance.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient operation in controlling large amounts of power.

Package Shape: RECTANGULAR

Rectangular shape provides easy mounting and integration into existing systems, making it convenient for installation and maintenance.

Nominal Turn Off Time (toff): 610 ns

Fast turn off time ensures minimal power loss and heat generation, improving overall efficiency of power control system.

No. of Elements: 7

Multiple elements enhance the overall performance and capability of the IGBT, making it suitable for complex power control requirements.

No. of Terminals: 24

Higher number of terminals allow for more versatile connections and control options, increasing flexibility in system design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting, ensuring reliable operation even in harsh environments.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance allows for reliable operation in extreme conditions, improving overall durability.

Maximum Collector-Emitter Voltage: 1200 V

High voltage capacity makes it suitable for applications requiring control of high voltage power, ensuring safety and efficiency.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and high breakdown voltage, enhancing the reliability and performance of the IGBT.

Maximum Collector Current (IC): 40 A

High collector current capability allows for handling large current loads, making it suitable for high power applications.

Terminal Position: UPPER

Upper terminal position simplifies wiring and connections, ensuring easy installation and maintenance.

Case Connection: ISOLATED

Isolated case connection provides electrical insulation and protection, ensuring safety and preventing potential short circuits.

Nominal Turn On Time (ton): 140 ns

Fast turn on time allows for quick response and accurate control, improving the overall performance of the power control system.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Trade Compliance

FP25R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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