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FP25R12W1T7B11BPSA1

Infineon Technologies

FP25R12W1T7B11BPSA1 by Infineon Technologies

Infineon Technologies' FP25R12W1T7B11BPSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 25A max collector current, and 730ns nominal turn off time. Ideal for power control applications due to its complex configuration and silicon transistor element material.

Median Price

$38.796

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 22 parts In-Stock

1+ parts

$34.670

100+ parts

-

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-

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22

$34.670

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-

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Arrow

USA . 11 parts In-Stock

1+ parts

$38.483

100+ parts

-

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11

$38.483

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-

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DigiKey

USA . 24 parts In-Stock

1+ parts

$39.110

100+ parts

$26.625

1k+ parts

$26.314

10k+ parts

-

24

$39.110

$26.625

$26.314

-

Mouser Electronics

USA . 17 parts In-Stock

1+ parts

$39.110

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-

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17

$39.110

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Chip1Stop

Japan . 13 parts In-Stock

1+ parts

$39.200

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-

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13

$39.200

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Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$26.320

1k+ parts

$23.550

10k+ parts

$22.160

100

-

$26.320

$23.550

$22.160

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$32.900

1k+ parts

$29.438

10k+ parts

$27.700

100

-

$32.900

$29.438

$27.700

RS (Exports)

UK . 2 parts In-Stock

1+ parts

-

100+ parts

$42.166

1k+ parts

-

10k+ parts

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2

-

$42.166

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 344 parts In-Stock

1+ parts

$16.748

100+ parts

-

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344

$16.748

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$52.150

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150

$52.150

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$56.930

100+ parts

$51.460

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100

$56.930

$51.460

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Vyrian

USA . 7,899 parts In-Stock

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7,899

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 8,445 parts In-Stock

1+ parts

$0.536

100+ parts

$0.515

1k+ parts

$0.493

10k+ parts

-

8,445

$0.536

$0.515

$0.493

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$0.866

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147

$0.866

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Aztec Data Supply Inc.

USA . 72 parts In-Stock

1+ parts

$1.201

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-

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72

$1.201

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$7.400

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607

$7.400

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Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$14.890

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15

$14.890

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Semicontronic

India . 15 parts In-Stock

1+ parts

$14.890

100+ parts

$14.518

1k+ parts

$14.443

10k+ parts

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15

$14.890

$14.518

$14.443

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Corphita

USA . 184 parts In-Stock

1+ parts

$15.867

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184

$15.867

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$51.107

100+ parts

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1k+ parts

$49.063

10k+ parts

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100

$51.107

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$49.063

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Continental Prestige Electronics

USA . 2,591 parts In-Stock

1+ parts

$52.150

100+ parts

-

1k+ parts

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10k+ parts

$51.107

2,591

$52.150

-

-

$51.107

Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$53.193

100+ parts

$53.193

1k+ parts

$53.193

10k+ parts

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61

$53.193

$53.193

$53.193

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Microchip USA

USA . 8,827 parts In-Stock

1+ parts

$137.954

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8,827

$137.954

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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Argo Parts USA

USA . 3,141 parts In-Stock

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3,141

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Overview

Unlock the power of cutting-edge technology with the FP25R12W1T7B11BPSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this one, designed for complex power control applications. With its N-CHANNEL configuration and 7 elements, this transistor offers maximum collector-emitter voltage of 1200V and a nominal turn off time of 730ns. Trust Infineon for reliability, efficiency, and superior performance in every application. Experience the difference with the FP25R12W1T7B11BPSA1!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their higher efficiency and faster switching speeds compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: COMPLEX

Complex IGBT configurations offer greater flexibility in designing circuits for specific power control needs, allowing for more precise control and efficiency.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficiently regulating and managing power flow in various systems.

Package Shape: RECTANGULAR

Rectangular packages provide a more compact and space-efficient design, suitable for applications where size and layout constraints are important.

Nominal Turn Off Time (toff): 730 ns

The relatively fast turn-off time of 730 ns ensures quick switching and minimal power loss during the switching process, improving overall efficiency.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage of 1200 V, this IGBT can handle high voltage applications with ease, making it suitable for a wide range of power control tasks.

Maximum Gate-Emitter Threshold Voltage: 6.45 V

The low gate-emitter threshold voltage of 6.45 V allows for efficient and precise control over the switching behavior of the IGBT, enhancing performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W1T7B11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.45 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

730 ns

Nominal Turn On Time (ton):

65 ns

Trade Compliance

FP25R12W1T7B11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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