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IRG4BC20UDPBF

Infineon Technologies

IRG4BC20UDPBF by Infineon Technologies

IRG4BC20UDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Gate-Emitter Voltage of 20V. It has a Nominal Turn Off Time of 320ns, making it suitable for POWER CONTROL applications requiring fast switching speeds. The transistor comes in a RECTANGULAR package style with THROUGH-HOLE terminals, ideal for high-power applications up to 60W at temperatures up to 150°C.

Median Price

$2.076

Lifecycle Status

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7

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Nova Conductors

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Ozdisan Elektronik

Türkiye . 2,522 parts In-Stock

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$2.076

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Voyager Components

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$6.356

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Modulus Dynamics

Lithuania . 17,776 parts In-Stock

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$0.360

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$0.346

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$0.331

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17,776

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Corohmni

South Africa . 4 parts In-Stock

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$0.467

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Continental Prestige Electronics

USA . 4,237 parts In-Stock

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$0.837

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$0.820

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Argo Parts USA

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Netroflash

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Aztec Data Supply Inc.

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Component Stockers USA

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Microchip USA

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Overview

Boost your power control applications with the IRG4BC20UDPBF Insulated Gate Bipolar Transistor from Infineon Technologies. Designed with high-quality materials and advanced technology, this N-CHANNEL transistor offers reliable performance and efficiency. With a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V, this transistor is perfect for various power control tasks. Experience fast turn-off and turn-on times without compromising on power dissipation. Upgrade your projects today with the IRG4BC20UDPBF and enjoy seamless power control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency, making them a popular choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide better protection against reverse voltage, enhancing the overall reliability of the product.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high performance and efficiency in managing power flow.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, making installation and maintenance easier.

Maximum Fall Time (tf): 170 ns

The low fall time ensures fast switching speeds, reducing power losses and improving overall efficiency.

Nominal Turn Off Time (toff): 320 ns

The nominal turn-off time allows for precise control over power flow, enhancing the product's performance in power control applications.

No. of Terminals: 3

The three terminals provide flexibility in circuit design and allow for easy connection to external components.

Maximum Power Dissipation (Abs): 60 W

With a high maximum power dissipation, this IGBT can handle high power applications without overheating or damage.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures secure mounting and thermal management, improving the reliability and lifespan of the product.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions and maintain performance under high temperatures.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows for the handling of high voltage applications with ease.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its performance and durability, making it an excellent choice for the transistor element.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures stable and reliable operation, reducing the risk of malfunction or damage.

Maximum Collector Current (IC): 13 A

With a high maximum collector current rating, this IGBT can handle high current loads without compromising performance.

Maximum Gate-Emitter Threshold Voltage: 6 V

The low gate-emitter threshold voltage allows for precise control over the switching behavior, improving the overall efficiency and performance of the product.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, reducing the chances of wiring errors.

Case Connection: COLLECTOR

The case connection to the collector ensures efficient heat dissipation and thermal management, enhancing the overall reliability and performance of the product.

Nominal Turn On Time (ton): 55 ns

The low turn-on time ensures fast switching speeds and precise control over power flow, making this IGBT ideal for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC20UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

170 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

IRG4BC20UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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