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FS450R17KE3

Infineon Technologies

FS450R17KE3 by Infineon Technologies

FS450R17KE3 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements, 1700V VCEsat, and 605A IC. It features a rectangular package style, 2250W power dissipation, and operates up to 150°C. Ideal for high-power applications requiring fast turn-on/off times and high collector current capabilities.

Median Price

$1,110.680

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 30 parts In-Stock

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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Nova Conductors

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Tech-Mark Corp

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Modulus Dynamics

Lithuania . 3,948 parts In-Stock

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$0.454

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$0.436

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$0.418

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AZTECH Wire

Italy . 329 parts In-Stock

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Continental Prestige Electronics

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Lixinc

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Perfect Parts

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Bastille Electronics

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Corphita

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Metaverse IC Inc.

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Argo Parts USA

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Assy Fe

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Overview

Unleash the power of cutting-edge technology with the FS450R17KE3 by Infineon Technologies. As a leader in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors. This N-CHANNEL IGBT offers superior performance with its 3 bank configuration, built-in diode, and thermistor for seamless operation. Whether you're in industrial automation, renewable energy, or electric vehicles, this product provides unmatched value with its high power dissipation, fast turn-on/off times, and high collector current. Elevate your projects with the FS450R17KE3 and experience the difference Infineon can make.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer higher mobility and conductivity, making them more efficient for high power applications.

Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration provides improved power handling capabilities and better thermal management, making the IGBT suitable for demanding industrial applications.

Maximum VCEsat: 2.45 V

Low VCEsat ensures low on-state voltage drop, resulting in reduced power losses and improved efficiency.

No. of Elements: 6

Having 6 elements increases the current handling capacity and power capabilities of the IGBT, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 2250 W

With a high power dissipation capability, this IGBT can handle high power levels without overheating, ensuring reliability in operation.

Maximum Collector-Emitter Voltage: 1700 V

High maximum collector-emitter voltage allows the IGBT to be used in high voltage applications, providing versatility in industrial applications.

Maximum Collector Current (IC): 605 A

High collector current rating enables the IGBT to handle large currents, making it suitable for high current applications like motor control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS450R17KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X29

No. of Elements:

6

No. of Terminals:

29

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1300 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.45 V

Trade Compliance

FS450R17KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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