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FGD3040G2-F085V

Onsemi

FGD3040G2-F085V by Onsemi

FGD3040G2-F085V by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.85V and a max collector current (IC) of 41A. It is commonly used for power control applications due to its high power dissipation of 150W and small outline package style.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,477 parts In-Stock

1+ parts

$2.070

100+ parts

$0.893

1k+ parts

$0.672

10k+ parts

$0.549

2,477

$2.070

$0.893

$0.672

$0.549

Mouser Electronics

USA . 87 parts In-Stock

1+ parts

$2.140

100+ parts

$0.913

1k+ parts

$0.686

10k+ parts

$0.636

87

$2.140

$0.913

$0.686

$0.636

Rochester

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$0.745

1k+ parts

$0.619

10k+ parts

$0.551

7,500

-

$0.745

$0.619

$0.551

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.773

10k+ parts

$0.689

5,000

-

-

$0.773

$0.689

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.624

2,500

-

-

-

$2.624

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.871

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.871

-

-

-

Digiode

USA . 870 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

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-

870

$2.090

-

-

-

Cyclops Electronics Ltd

UK . 19,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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19,500

-

-

-

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Vyrian

USA . 3,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,169

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,696 parts In-Stock

1+ parts

$0.770

100+ parts

$0.751

1k+ parts

$0.747

10k+ parts

-

4,696

$0.770

$0.751

$0.747

-

Ampacity Inc.

Singapore . 3,189 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

3,189

$0.770

-

-

-

Corohmni

South Africa . 243 parts In-Stock

1+ parts

$0.853

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$0.853

-

-

-

Argo Parts USA

USA . 3,773 parts In-Stock

1+ parts

$0.871

100+ parts

-

1k+ parts

-

10k+ parts

-

3,773

$0.871

-

-

-

Continental Prestige Electronics

USA . 2,332 parts In-Stock

1+ parts

$0.871

100+ parts

-

1k+ parts

-

10k+ parts

$0.853

2,332

$0.871

-

-

$0.853

Aztec Data Supply Inc.

USA . 219 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

219

$1.800

-

-

-

Corphita

USA . 2,072 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

$1.980

-

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-

Microchip USA

USA . 8,837 parts In-Stock

1+ parts

$5.269

100+ parts

-

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-

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8,837

$5.269

-

-

-

ChipstoGo Electronic ltd

UK . 20,000 parts In-Stock

1+ parts

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20,000

-

-

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Perfect Parts

USA . 16,374 parts In-Stock

1+ parts

-

100+ parts

-

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16,374

-

-

-

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Problanco Electronics

Mexico . 7,533 parts In-Stock

1+ parts

-

100+ parts

-

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7,533

-

-

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Kulean Microsystems

USA . 6,875 parts In-Stock

1+ parts

-

100+ parts

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6,875

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SupplyDigital Components

Austria . 3,232 parts In-Stock

1+ parts

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100+ parts

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3,232

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TANS Electronics

Latvia . 2,943 parts In-Stock

1+ parts

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2,943

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

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UHIMA Technologies

Türkiye . 889 parts In-Stock

1+ parts

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889

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iodParts Technologies Inc.

India . 64 parts In-Stock

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64

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Overview

Experience the power and reliability of the FGD3040G2-F085V by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Designed for power control applications, this single-channel transistor comes with a built-in diode and resistor, offering unmatched convenience and efficiency. With its durable plastic/epoxy body material and gull wing terminal form, it guarantees long-lasting performance. Whether you're in the automotive, industrial, or consumer electronics sector, the FGD3040G2-F085V is the perfect choice for your needs. Trust Onsemi's expertise and unlock the full potential of your projects with this exceptional product.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. The use of plastic/epoxy package body material offers durability and protection, making this IGBT suitable for various environments.

Polarity or Channel Type:

N-CHANNEL. The N-channel configuration ensures efficient power control and enhanced performance, making this IGBT ideal for power control applications.

Configuration:

SINGLE WITH BUILT-IN DIODE AND RESISTOR. The inclusion of a built-in diode and resistor simplifies circuit design and saves space, making this IGBT a convenient choice for power control applications.

Transistor Application:

POWER CONTROL. Designed specifically for power control, this IGBT delivers reliable and precise power control capabilities.

Surface Mount:

YES. The surface mount feature allows for easy and efficient installation, making this IGBT suitable for modern circuit board designs.

Maximum Rise Time (tr):

7000 ns. The fast rise time of 7000 ns enables quick response and precise power switching, enhancing the overall performance of this IGBT.

Maximum VCEsat:

1.85 V. With a low maximum VCEsat value of 1.85 V, this IGBT reduces power losses and improves energy efficiency for power control applications.

Package Shape:

RECTANGULAR. The rectangular package shape offers compatibility and ease of integration, making this IGBT suitable for various circuit designs and layouts.

Terminal Form:

GULL WING. The gull wing terminal form ensures secure connections and efficient heat dissipation, contributing to the reliability and longevity of this IGBT.

No. of Elements:

1. This IGBT consists of a single element, simplifying circuit design and allowing for easy integration into power control systems.

Maximum Fall Time (tf):

15000 ns. The maximum fall time of 15000 ns ensures fast switching and precise power control, enhancing the overall performance of this IGBT.

Nominal Turn Off Time (toff):

6800 ns. The nominal turn off time of 6800 ns enables efficient power switching and precise control, making this IGBT an excellent choice for power control applications.

No. of Terminals:

2. With two terminals, this IGBT offers simple connectivity and facilitates easy installation.

Maximum Power Dissipation (Abs):

150 W. The high maximum power dissipation of 150 W allows for reliable and stable power control, making this IGBT suitable for demanding applications.

Package Style (Meter):

SMALL OUTLINE. The small outline package style offers compactness and easy integration, making this IGBT suitable for applications with limited space.

Maximum Operating Temperature:

175 °C. The high maximum operating temperature of 175 °C ensures reliable and stable performance in challenging thermal conditions, making this IGBT suitable for a wide range of environments.

Maximum Collector-Emitter Voltage:

390 V. With a high maximum collector-emitter voltage of 390 V, this IGBT can handle high voltage levels, making it suitable for power control applications.

Transistor Element Material:

SILICON. The use of silicon as the transistor element material guarantees excellent performance and reliability, making this IGBT a dependable choice for power control applications.

Maximum Turn On Time (ton):

11000 ns. The maximum turn on time of 11000 ns ensures fast response and precise power switching, enhancing the overall efficiency of this IGBT.

Maximum Gate-Emitter Voltage:

10 V. With a maximum gate-emitter voltage of 10 V, this IGBT offers versatility and compatibility with various control circuits and systems.

Minimum Operating Temperature:

55 °C. The low minimum operating temperature of -55 °C allows for reliable performance even in extreme cold conditions, making this IGBT suitable for diverse environments.

Maximum Collector Current (IC):

41 A. With a high maximum collector current of 41 A, this IGBT can handle high current loads, making it suitable for demanding power control applications.

Maximum Gate-Emitter Threshold Voltage:

2.2 V. The maximum gate-emitter threshold voltage of 2.2 V ensures precise and reliable control, making this IGBT an excellent choice for power control applications.

Maximum Turn Off Time (toff):

30000 ns. The maximum turn off time of 30000 ns allows for efficient power switching and precise control, enhancing the overall performance of this IGBT.

Terminal Finish:

Matte Tin (Sn) - annealed. The matte tin (Sn) terminal finish provides excellent solderability and long-term reliability, ensuring secure connections and optimal performance.

Terminal Position:

SINGLE. With a single terminal position, this IGBT offers easy installation and connectivity.

Moisture Sensitivity Level (MSL):

1. The moisture sensitivity level of 1 ensures that the IGBT remains protected from moisture damage during storage and handling, guaranteeing long-term reliability.

Case Connection:

COLLECTOR. The case connection to the collector allows for efficient heat dissipation and thermal management, contributing to the reliability and longevity of this IGBT.

Maximum Time At Peak Reflow Temperature (s):

30. The maximum time at peak reflow temperature of 30 seconds ensures optimal soldering and reliable connectivity during assembly.

Peak Reflow Temperature °C:

260. The peak reflow temperature of 260°C enhances solder joint reliability and ensures secure and durable connections.

Nominal Turn On Time (ton):

2800 ns. The nominal turn on time of 2800 ns ensures quick response and precise power switching, improving the overall efficiency of this IGBT.

Reference Standard:

AEC-Q101. Complying with the AEC-Q101 reference standard guarantees the quality and reliability of this IGBT, making it suitable for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3040G2-F085V attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

6800 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2800 ns

Maximum VCEsat:

1.85 V

Trade Compliance

FGD3040G2-F085V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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