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FGD3325G2-F085V

Onsemi

FGD3325G2-F085V by Onsemi

FGD3325G2-F085V by Onsemi is an N-CHANNEL IGBT with built-in TVS diode and resistor, ideal for automotive ignition applications. It features a max VCEsat of 1.25V, collector current of 41A, and operating temperature range from -55 to 175°C. This surface-mount transistor has a rectangular package style with gull wing terminals.

Median Price

$2.760

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,771 parts In-Stock

1+ parts

$2.760

100+ parts

$1.228

1k+ parts

$0.913

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-

3,771

$2.760

$1.228

$0.913

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Mouser Electronics

USA . 2,115 parts In-Stock

1+ parts

$2.760

100+ parts

$1.230

1k+ parts

$0.936

10k+ parts

-

2,115

$2.760

$1.230

$0.936

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,357 parts In-Stock

1+ parts

$2.138

100+ parts

-

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2,357

$2.138

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Vyrian

USA . 1,516 parts In-Stock

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$2.250

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-

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1,516

$2.250

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Distributors (Availability)

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Native Components

USA . 252 parts In-Stock

1+ parts

$1.070

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-

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252

$1.070

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Northwest PG Solutions

USA . 402 parts In-Stock

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$1.177

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402

$1.177

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Component Stockers USA

USA . 6,651 parts In-Stock

1+ parts

$1.900

100+ parts

$1.260

1k+ parts

$0.900

10k+ parts

-

6,651

$1.900

$1.260

$0.900

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Corphita

USA . 754 parts In-Stock

1+ parts

$2.025

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754

$2.025

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Corohmni

South Africa . 364 parts In-Stock

1+ parts

$2.250

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364

$2.250

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Microchip USA

USA . 4,800 parts In-Stock

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$4.919

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4,800

$4.919

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SupplyDigital Components

Austria . 5,676 parts In-Stock

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5,676

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Kulean Microsystems

USA . 4,734 parts In-Stock

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4,734

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Problanco Electronics

Mexico . 3,514 parts In-Stock

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TANS Electronics

Latvia . 1,324 parts In-Stock

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1,324

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 789 parts In-Stock

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789

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Overview

Accelerate your automotive ignition systems with the FGD3325G2-F085V by Onsemi. Crafted with precision and quality in mind, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance and reliability. Whether you're looking to enhance the efficiency of your vehicle's ignition system or boost overall power output, this N-CHANNEL transistor with a built-in TVS diode and resistor is designed to meet your needs. Trust in Onsemi's expertise in semiconductor manufacturing to deliver a product that exceeds expectations. Upgrade your automotive electronics with the FGD3325G2-F085V and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for automotive applications where it may be exposed to harsh environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and higher efficiency, making them a good choice for power electronic applications.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition applications, ensuring reliability and optimal performance in this specific use case.

Maximum Collector-Emitter Voltage: 240 V

With a high maximum voltage rating, this IGBT can handle high voltage operations and is suitable for a wide range of applications.

Maximum Collector Current (IC): 41 A

The high collector current rating allows this IGBT to handle higher power levels, making it suitable for automotive ignition systems and other high-power applications.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this IGBT can handle high power levels without overheating, ensuring reliability in demanding applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3325G2-F085V attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

240 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

7300 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2000 ns

Maximum VCEsat:

1.25 V

Trade Compliance

FGD3325G2-F085V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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