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FGD3245G2-F085C

Onsemi

FGD3245G2-F085C by Onsemi

FGD3245G2-F085C by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.25V and a max IC of 23A. Designed for automotive ignition applications, it features a built-in diode and resistor in a small outline package, suitable for surface mount assembly.

Median Price

$1.612

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,116 parts In-Stock

1+ parts

$1.980

100+ parts

$1.250

1k+ parts

$0.948

10k+ parts

$0.887

7,116

$1.980

$1.250

$0.948

$0.887

DigiKey

USA . 309 parts In-Stock

1+ parts

$2.930

100+ parts

$1.310

1k+ parts

-

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-

309

$2.930

$1.310

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Rochester

USA . 797 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

797

-

$1.200

$0.996

$0.888

Verical

USA . 797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.245

10k+ parts

$1.110

797

-

-

$1.245

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,953 parts In-Stock

1+ parts

$0.937

100+ parts

-

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1,953

$0.937

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Vyrian

USA . 279 parts In-Stock

1+ parts

$0.986

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-

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279

$0.986

-

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Flip Electronics

USA . 1,205 parts In-Stock

1+ parts

-

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1,205

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Nova Conductors

Japan . 100 parts In-Stock

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100

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,860 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

3,860

$0.760

-

-

-

Corphita

USA . 1,140 parts In-Stock

1+ parts

$0.887

100+ parts

-

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1,140

$0.887

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-

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Corohmni

South Africa . 52 parts In-Stock

1+ parts

$0.986

100+ parts

-

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-

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52

$0.986

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-

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Microchip USA

USA . 186 parts In-Stock

1+ parts

$6.898

100+ parts

-

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186

$6.898

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SupplyDigital Components

Austria . 7,497 parts In-Stock

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7,497

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Kulean Microsystems

USA . 5,989 parts In-Stock

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5,989

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Problanco Electronics

Mexico . 1,847 parts In-Stock

1+ parts

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1,847

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TANS Electronics

Latvia . 1,845 parts In-Stock

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1,845

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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UHIMA Technologies

Türkiye . 249 parts In-Stock

1+ parts

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249

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Upgrade your automotive ignition systems with the FGD3245G2-F085C by Onsemi. This N-CHANNEL IGBT is designed for high performance and reliability, making it a top choice for automotive applications. With a built-in diode and resistor, this transistor offers convenience and efficiency in one package. Trust in the quality and expertise of Onsemi to deliver cutting-edge technology that meets your needs. Experience seamless operation, increased power dissipation, and enhanced performance with the FGD3245G2-F085C. Drive innovation with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components, making it suitable for automotive applications where ruggedness is required.

Maximum VCEsat: 1.25 V

The low VCEsat value of 1.25V indicates efficient switching performance, resulting in reduced power loss and increased efficiency.

Maximum Power Dissipation: 150 W

With a high power dissipation capability of 150W, this IGBT can handle high current and voltage levels without overheating, making it reliable for automotive ignition systems.

Maximum Collector-Emitter Voltage: 440 V

The high maximum collector-emitter voltage of 440V ensures that the IGBT can withstand high voltage spikes and surges, making it suitable for automotive applications where voltage fluctuations are common.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows the IGBT to operate reliably in high-temperature environments commonly found in automotive engine compartments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3245G2-F085C attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

8100 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

3500 ns

Maximum VCEsat:

1.25 V

Trade Compliance

FGD3245G2-F085C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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