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FS75R12KS4BOSA1

Infineon Technologies

FS75R12KS4BOSA1 by Infineon Technologies

Infineon FS75R12KS4BOSA1 is a N-CHANNEL IGBT with 6 elements in BRIDGE configuration. Features include 1200V max collector-emitter voltage, 100A max collector current, and 390ns turn off time. Ideal for high-power applications requiring fast switching such as motor drives and inverters.

Median Price

$350.078

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 354 parts In-Stock

1+ parts

$311.180

100+ parts

$292.510

1k+ parts

$273.840

10k+ parts

-

354

$311.180

$292.510

$273.840

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Verical

USA . 354 parts In-Stock

1+ parts

$388.975

100+ parts

$365.637

1k+ parts

$342.300

10k+ parts

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354

$388.975

$365.637

$342.300

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 571 parts In-Stock

1+ parts

$344.109

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-

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571

$344.109

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Vyrian

USA . 2,327 parts In-Stock

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2,327

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Nova Conductors

Japan . 500 parts In-Stock

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500

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TME

Poland . 6 parts In-Stock

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6

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 309 parts In-Stock

1+ parts

$1.040

100+ parts

-

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309

$1.040

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Corohmni

South Africa . 781 parts In-Stock

1+ parts

$1.880

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-

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781

$1.880

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Modulus Dynamics

Lithuania . 14,580 parts In-Stock

1+ parts

$1.983

100+ parts

$1.904

1k+ parts

$1.824

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-

14,580

$1.983

$1.904

$1.824

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AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$13.326

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557

$13.326

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Ampacity Inc.

Singapore . 354 parts In-Stock

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$307.890

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354

$307.890

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Semicontronic

India . 354 parts In-Stock

1+ parts

$307.890

100+ parts

$300.193

1k+ parts

$298.653

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354

$307.890

$300.193

$298.653

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Corphita

USA . 887 parts In-Stock

1+ parts

$325.998

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887

$325.998

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Advanced Electronics

New Zealand . 55 parts In-Stock

1+ parts

$352.895

100+ parts

$324.664

1k+ parts

$304.220

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55

$352.895

$324.664

$304.220

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QUARKTWIN TECHNOLOGY LTD

USA . 27,406 parts In-Stock

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Microchip USA

USA . 9,043 parts In-Stock

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9,043

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Continental Prestige Electronics

USA . 5,364 parts In-Stock

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5,364

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 879 parts In-Stock

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879

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock the power of advanced technology with the FS75R12KS4BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this one, offering customers unparalleled performance and reliability. With its N-CHANNEL configuration and 6-element design with built-in diode, this IGBT is ideal for a wide range of applications. From industrial automation to renewable energy systems, the FS75R12KS4BOSA1 provides value, efficiency, and innovation, making it the perfect choice for your next project.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - This makes the IGBT suitable for applications requiring high power and fast switching speeds.

Configuration:

BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE - This configuration allows for easy implementation in bridge circuits and ensures efficient operation.

Package Shape:

RECTANGULAR - The rectangular shape of the package makes it easy to mount and provides good thermal dissipation.

No. of Elements:

6 - Having 6 elements allows for higher current carrying capacity and better performance in demanding applications.

Nominal Turn Off Time (toff):

390 ns - The quick turn-off time enhances the efficiency of the IGBT and reduces switching losses.

No. of Terminals:

39 - The numerous terminals provide flexibility in circuit design and allow for various connection options.

Package Style (Meter):

FLANGE MOUNT - The flange mount style enables secure attachment to a heatsink for improved thermal management.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, the IGBT can withstand harsh environmental conditions.

Maximum Collector-Emitter Voltage:

1200 V - The high voltage rating makes it suitable for high-power applications.

Transistor Element Material:

SILICON - Silicon-based transistor elements offer high reliability and performance in power electronics.

Maximum Collector Current (IC):

100 A - The high collector current rating allows the IGBT to handle large amounts of current without overheating.

Terminal Position:

UPPER - The upper terminal position simplifies the connection of the IGBT in circuits and minimizes the risk of short circuits.

Case Connection:

ISOLATED - The isolated case connection enhances safety and reduces the risk of electrical malfunctions.

Nominal Turn On Time (ton):

190 ns - The fast turn-on time ensures quick response in switching applications, improving overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R12KS4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X39

No. of Elements:

6

No. of Terminals:

39

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

390 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

FS75R12KS4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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