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IRG4PC50SPBF

Infineon Technologies

IRG4PC50SPBF by Infineon Technologies

IRG4PC50SPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Collector Current of 70A. It has a Nominal Turn Off Time of 1700ns, making it suitable for high-power applications like motor drives and inverters. The package style is FLANGE MOUNT with a Max Power Dissipation of 200W at an operating temperature up to 150°C.

Median Price

$3.787

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$3.787

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$3.787

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Chip Stock

USA . 646 parts In-Stock

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646

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Digiode

USA . 193 parts In-Stock

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193

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Vyrian

USA . 87 parts In-Stock

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87

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 338 parts In-Stock

1+ parts

$1.300

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338

$1.300

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Continental Prestige Electronics

USA . 4,141 parts In-Stock

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$3.787

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$3.711

4,141

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$3.711

Argo Parts USA

USA . 1,387 parts In-Stock

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$3.787

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1,387

$3.787

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Modulus Dynamics

Lithuania . 18,562 parts In-Stock

1+ parts

$3.787

100+ parts

$3.636

1k+ parts

$3.484

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18,562

$3.787

$3.636

$3.484

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Corohmni

South Africa . 202 parts In-Stock

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$3.787

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202

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$3.863

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$3.863

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$3.863

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2,500

$3.863

$3.863

$3.863

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AZTECH Wire

Italy . 87 parts In-Stock

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$5.246

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87

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Semicontronic

India . 446 parts In-Stock

1+ parts

$17.050

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$16.624

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$16.538

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446

$17.050

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$16.538

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Ampacity Inc.

Singapore . 1,437 parts In-Stock

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$42.050

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Component Stockers USA

USA . 680 parts In-Stock

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$99.990

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680

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,707 parts In-Stock

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Perfect Parts

USA . 17,696 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,878 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,585 parts In-Stock

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4,585

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Metaverse IC Inc.

Canada . 1,197 parts In-Stock

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Corphita

USA . 938 parts In-Stock

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938

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Netroflash

USA . 500 parts In-Stock

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$3.711

1k+ parts

$3.598

10k+ parts

$3.522

500

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$3.711

$3.598

$3.522

Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Unleash the power of innovation with the IRG4PC50SPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This single N-Channel transistor offers unparalleled performance and reliability, making it ideal for a wide range of applications. Experience the value and benefits of this product as it enhances efficiency and boosts productivity in your projects. Upgrade to the IRG4PC50SPBF today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and mechanical strength, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower on-state resistance and better switching characteristics, making them suitable for high power applications.

Maximum Power Dissipation (Abs): 200 W

With a high maximum power dissipation, this IGBT can handle high power levels without overheating.

Maximum Collector-Emitter Voltage: 600 V

This high voltage rating allows the IGBT to be used in a variety of high voltage applications.

Maximum Collector Current (IC): 70 A

The high collector current rating ensures that the IGBT can handle high current loads safely and efficiently.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can operate reliably in high temperature environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50SPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

600 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1700 ns

Nominal Turn On Time (ton):

62 ns

Trade Compliance

IRG4PC50SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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