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IRG4PC50UDPBF

Infineon Technologies

IRG4PC50UDPBF by Infineon Technologies

IRG4PC50UDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2V and a max IC of 55A. It is designed for POWER CONTROL applications, featuring a package style of FLANGE MOUNT and operating temperatures ranging from -55 to 150 °C.

Median Price

$10.465

Lifecycle Status

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10

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1k+

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Nova Conductors

Japan . 1,000 parts In-Stock

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$10.465

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Vyrian

USA . 1,500 parts In-Stock

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Digiode

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Cogito LLC

Ukraine . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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LWI Electronics Inc

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Bristol Electronics

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Dan-Mar Components

USA . 5 parts In-Stock

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ComSIT Distribution GmbH

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Aztec Data Supply Inc.

USA . 165 parts In-Stock

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$0.899

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$0.899

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Modulus Dynamics

Lithuania . 14,417 parts In-Stock

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$8.119

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$7.794

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$7.469

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$7.469

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Corohmni

South Africa . 726 parts In-Stock

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$8.119

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$8.281

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$8.281

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$8.281

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$8.281

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AZTECH Wire

Italy . 287 parts In-Stock

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$9.930

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Continental Prestige Electronics

USA . 875 parts In-Stock

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$10.465

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$10.255

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Ampacity Inc.

Singapore . 1,539 parts In-Stock

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$18.050

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Semicontronic

India . 832 parts In-Stock

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$19.050

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$18.574

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$18.478

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832

$19.050

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Component Stockers USA

USA . 629 parts In-Stock

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$99.990

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Perfect Parts

USA . 35,366 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,639 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,759 parts In-Stock

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Kepictronics

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Glotronic Ltd.

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Argo Parts USA

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Microchip USA

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Netroflash

USA . 500 parts In-Stock

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$10.255

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$9.941

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$9.732

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Corphita

USA . 426 parts In-Stock

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Assy Fe

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Overview

Discover the power of the IRG4PC50UDPBF by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor designed for power control applications. With Infineon's reputation for excellence in semiconductor manufacturing, this N-CHANNEL transistor offers single configuration with a built-in diode, ensuring efficient performance and reliable operation. Experience the benefits of its 600V maximum collector-emitter voltage, 55A maximum collector current, and fast switching speeds. Trust in Infineon's expertise and innovation to elevate your power control systems to new heights with the IRG4PC50UDPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drops and faster switching speeds, making them efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better switching characteristics and protection against voltage spikes, enhancing overall reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable operation in high-power scenarios.

Maximum VCEsat: 2 V

Low VCEsat helps minimize power losses and improve efficiency in power switching applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, enhancing the reliability of the component.

Maximum Fall Time (tf): 110 ns

Fast fall time enables quick switching and helps reduce power dissipation during switching transitions.

Nominal Turn Off Time (toff): 214 ns

The fast turn-off time contributes to efficient power control and minimizes switching losses.

No. of Terminals: 3

Having 3 terminals allows for easy interfacing with external circuitry and control systems.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability ensures the component can handle high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style facilitates secure mounting and heat dissipation, enhancing the reliability of the component.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the component can operate reliably in a wide range of environments.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows for use in high-voltage applications, expanding the range of possible use cases.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a high gate-emitter voltage rating, the component is less susceptible to voltage spikes or ESD events, improving overall robustness.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, the component can operate reliably in cold environments without issues.

Maximum Collector Current (IC): 55 A

High collector current rating enables the component to handle large current loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage enables efficient control over the switching characteristics of the IGBT.

Maximum Turn Off Time (toff): 340 ns

The maximum turn-off time ensures faster switching speed and reduced power losses during the turn-off process.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: SINGLE

Single terminal position simplifies the connection and integration of the component in various circuits.

Case Connection: COLLECTOR

The collector case connection simplifies the mounting and connection process, improving ease of use.

Nominal Turn On Time (ton): 71 ns

Fast turn-on time allows quick response to control signals, enhancing the efficiency and accuracy of power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

110 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

340 ns

Nominal Turn Off Time (toff):

214 ns

Nominal Turn On Time (ton):

71 ns

Maximum VCEsat:

2 V

Trade Compliance

IRG4PC50UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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