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IRG4BC40WLPBF

Infineon Technologies

IRG4BC40WLPBF by Infineon Technologies

IRG4BC40WLPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 40A. It has a power dissipation of 160W, making it suitable for power control applications. With a turn-off time of 294ns and turn-on time of 48ns, it offers efficient performance in high-power systems.

Median Price

$2.012

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,056 parts In-Stock

1+ parts

-

100+ parts

$1.900

1k+ parts

$1.700

10k+ parts

$1.600

15,056

-

$1.900

$1.700

$1.600

Verical

USA . 15,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.125

10k+ parts

$2.000

15,040

-

-

$2.125

$2.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 348 parts In-Stock

1+ parts

$2.004

100+ parts

-

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348

$2.004

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.067

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-

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10

$2.067

-

-

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DigiKey Marketplace

USA . 15,136 parts In-Stock

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15,136

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Vyrian

USA . 14,963 parts In-Stock

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14,963

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 13,392 parts In-Stock

1+ parts

$0.971

100+ parts

$0.932

1k+ parts

$0.893

10k+ parts

-

13,392

$0.971

$0.932

$0.893

-

Aztec Data Supply Inc.

USA . 727 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

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-

727

$1.120

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$1.679

100+ parts

$1.528

1k+ parts

$1.377

10k+ parts

-

200

$1.679

$1.528

$1.377

-

Semicontronic

India . 14,848 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

-

14,848

$1.790

$1.745

$1.736

-

Ampacity Inc.

Singapore . 14,662 parts In-Stock

1+ parts

$1.790

100+ parts

-

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14,662

$1.790

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Corohmni

South Africa . 25,530 parts In-Stock

1+ parts

$1.877

100+ parts

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25,530

$1.877

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Corphita

USA . 92 parts In-Stock

1+ parts

$1.899

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92

$1.899

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Continental Prestige Electronics

USA . 5,673 parts In-Stock

1+ parts

$2.049

100+ parts

-

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$2.008

5,673

$2.049

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-

$2.008

Argo Parts USA

USA . 1,739 parts In-Stock

1+ parts

$2.049

100+ parts

-

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1,739

$2.049

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.067

100+ parts

$2.026

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-

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500

$2.067

$2.026

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Microchip USA

USA . 9,422 parts In-Stock

1+ parts

$13.195

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9,422

$13.195

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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1,920

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A-Z Elektronik GmbH

Germany . 1,917 parts In-Stock

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1,917

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Perfect Parts

USA . 1,457 parts In-Stock

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1,457

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Alle Elektronik GmbH

Germany . 1,278 parts In-Stock

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1,278

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Robosynatics

Brazil . 200 parts In-Stock

1+ parts

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100+ parts

$3.060

1k+ parts

$3.060

10k+ parts

$3.060

200

-

$3.060

$3.060

$3.060

Overview

Discover the power and efficiency of the IRG4BC40WLPBF by Infineon Technologies. With a reputation for superior quality and reliability, Infineon Technologies delivers cutting-edge Insulated Gate Bipolar Transistors (IGBT) like no other. Ideal for power control applications, this N-CHANNEL transistor offers maximum performance in a compact package. Experience the benefits of fast response times, high power dissipation, and exceptional durability. Trust Infineon Technologies to provide you with the advanced technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and durability, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have lower on-state voltage drop and higher switching speeds compared to P-channel types, making them efficient for power control applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and reduces complexity, making it easier to integrate into systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in controlling high power levels.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into existing systems or circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are easier to solder onto circuit boards.

Maximum Fall Time (tf): 110 ns

Fast fall time allows for quick switching of the transistor, reducing power loss and improving efficiency.

Nominal Turn Off Time (toff): 294 ns

Low turn-off time ensures quick switching off of the transistor, reducing heat generation and improving overall performance.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability allows the transistor to handle high power levels without overheating or damage.

Package Style (Meter): IN-LINE

In-line package style offers a compact design for space-saving and easy integration into systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the transistor to operate efficiently even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating enables the transistor to handle high voltage levels, making it suitable for power control applications.

Transistor Element Material: SILICON

Silicon material provides good electrical properties and reliability, ensuring consistent performance over time.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for efficient control of the transistor's switching behavior and ensures reliability in operation.

Maximum Collector Current (IC): 40 A

High collector current allows the transistor to handle high current levels, making it suitable for power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient switching of the transistor, reducing power loss and improving performance.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel finish provides corrosion resistance and ensures reliable connections for long-term use.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures proper alignment for secure connections.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation and ensures stable performance under high power conditions.

Nominal Turn On Time (ton): 48 ns

Fast turn-on time enables quick switching of the transistor, reducing power losses and improving overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC40WLPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

110 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-262

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

294 ns

Nominal Turn On Time (ton):

48 ns

Trade Compliance

IRG4BC40WLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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