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FS75R07W2E3B11ABOMA1

Infineon Technologies

FS75R07W2E3B11ABOMA1 by Infineon Technologies

Infineon Technologies' FS75R07W2E3B11ABOMA1 is an N-CHANNEL IGBT with 6 elements, max. collector current of 95A, and max. collector-emitter voltage of 650V. Ideal for power control applications due to its complex configuration and fast turn on/off times (44ns/258ns). Package style: Flange mount with isolated case connection.

Median Price

$62.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$62.940

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Vyrian

USA . 3,942 parts In-Stock

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Rutronik

Germany . 1,005 parts In-Stock

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$50.820

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Digiode

USA . 193 parts In-Stock

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QIE Inc.

USA . 36 parts In-Stock

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NAC Semi

USA . 15 parts In-Stock

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$78.090

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Corohmni

South Africa . 245 parts In-Stock

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$0.886

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Ampacity Inc.

Singapore . 30 parts In-Stock

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$1.050

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$1.050

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Modulus Dynamics

Lithuania . 8,104 parts In-Stock

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$1.526

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$1.465

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$1.404

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$1.526

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Aztec Data Supply Inc.

USA . 4,163 parts In-Stock

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$1.950

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AZTECH Wire

Italy . 789 parts In-Stock

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Semicontronic

India . 15 parts In-Stock

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$42.050

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$40.999

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$40.788

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Continental Prestige Electronics

USA . 3,829 parts In-Stock

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$61.681

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

USA . 8,716 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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Eastek

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the FS75R07W2E3B11ABOMA1 by Infineon Technologies. This innovative Insulated Gate Bipolar Transistor (IGBT) boasts superior quality and reliability, making it the ideal choice for power control applications. With a maximum collector-emitter voltage of 650V and a nominal turn-off time of 258ns, this N-channel transistor offers unmatched performance and efficiency. Trust in Infineon's expertise in semiconductor manufacturing to deliver a product that exceeds expectations. Experience the value and benefits of the FS75R07W2E3B11ABOMA1 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: COMPLEX

COMPLEX configuration provides better control over the switching characteristics of the IGBT, allowing for optimized power control.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance in high-power circuits.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage allows for use in a wide range of applications, providing flexibility and reliability.

Maximum Collector Current (IC): 95 A

With a maximum collector current of 95 A, this IGBT can handle high power loads, making it suitable for demanding applications.

Nominal Turn On Time (ton): 44 ns

The fast turn-on time of 44 ns ensures quick response in power control applications, enhancing efficiency and precision.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R07W2E3B11ABOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

JESD-30 Code:

R-XUFM-X18

Moisture Sensitivity Level (MSL):

1

No. of Elements:

6

No. of Terminals:

18

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

258 ns

Nominal Turn On Time (ton):

44 ns

Trade Compliance

FS75R07W2E3B11ABOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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