Loading...

FS75R12W2T4BOMA1

Infineon Technologies

FS75R12W2T4BOMA1 by Infineon Technologies

Infineon's FS75R12W2T4BOMA1 is an N-CHANNEL IGBT with 6 elements, max. collector-emitter voltage of 1200V, and max. collector current of 107A. Ideal for power control applications, it features a nominal turn-off time of 490ns and nominal turn-on time of 185ns.

Median Price

$53.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$53.290

100+ parts

$38.856

1k+ parts

$38.567

10k+ parts

-

5

$53.290

$38.856

$38.567

-

Verical

USA . 2 parts In-Stock

1+ parts

$53.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$53.600

-

-

-

Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$56.700

100+ parts

$49.000

1k+ parts

$48.300

10k+ parts

-

12

$56.700

$49.000

$48.300

-

RS (Exports)

UK . 15 parts In-Stock

1+ parts

$74.290

100+ parts

$61.910

1k+ parts

$57.140

10k+ parts

-

15

$74.290

$61.910

$57.140

-

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$43.690

1k+ parts

$39.090

10k+ parts

$36.790

25

-

$43.690

$39.090

$36.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 34 parts In-Stock

1+ parts

$45.980

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$45.980

-

-

-

Vyrian

USA . 2,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,145

-

-

-

-

Nova Conductors

Japan . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 14,151 parts In-Stock

1+ parts

$0.310

100+ parts

$0.298

1k+ parts

$0.285

10k+ parts

-

14,151

$0.310

$0.298

$0.285

-

Corohmni

South Africa . 79 parts In-Stock

1+ parts

$1.374

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$1.374

-

-

-

Corphita

USA . 39 parts In-Stock

1+ parts

$43.560

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$43.560

-

-

-

Continental Prestige Electronics

USA . 7 parts In-Stock

1+ parts

$66.770

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$66.770

-

-

-

Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$89.540

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$89.540

-

-

-

Microchip USA

USA . 4,335 parts In-Stock

1+ parts

$184.598

100+ parts

-

1k+ parts

-

10k+ parts

-

4,335

$184.598

-

-

-

Argo Parts USA

USA . 4,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Elevate your power control capabilities with the FS75R12W2T4BOMA1 by Infineon Technologies. As a leading manufacturer in insulated gate bipolar transistors (IGBT), this N-channel transistor offers a complex configuration ideal for applications requiring high-performance power control. With six elements and a maximum collector-emitter voltage of 1200V, this rectangular package style transistor provides superior reliability and efficiency. Experience the value and benefits of Infineon's cutting-edge technology, from its fast turn-on and turn-off times to its high collector current capacity. Upgrade your power systems today with the FS75R12W2T4BOMA1 and unlock a new level of performance.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for higher current and voltage capabilities, making them suitable for power control applications.

Configuration: COMPLEX

Complex configuration allows for better control and efficient power management, making this IGBT ideal for power control applications.

Nominal Turn Off Time (toff): 490 ns

Low turn off time ensures fast switching speed, reducing power losses and improving efficiency in power control applications.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for handling high voltage applications, ensuring reliable performance in power control scenarios.

Maximum Collector Current (IC): 107 A

High collector current rating enables the IGBT to handle large currents, making it suitable for power control applications that require high power handling capabilities.

Nominal Turn On Time (ton): 185 ns

Low turn on time ensures quick response and efficient power switching, enhancing the performance of this IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R12W2T4BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X15

No. of Elements:

6

No. of Terminals:

15

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

490 ns

Nominal Turn On Time (ton):

185 ns

Trade Compliance

FS75R12W2T4BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19