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IRG4BC30KDPBF

Infineon Technologies

IRG4BC30KDPBF by Infineon Technologies

IRG4BC30KDPBF by Infineon is an N-CHANNEL IGBT transistor with 600V max collector-emitter voltage and 28A max collector current. It has a 120ns fall time, 370ns turn off time, and can handle up to 100W power dissipation. Ideal for motor control applications due to its single configuration and flange mount package style.

Median Price

$1.670

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100 parts In-Stock

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$1.670

100+ parts

$1.570

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$1.420

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100

$1.670

$1.570

$1.420

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Digiode

USA . 217 parts In-Stock

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$1.586

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217

$1.586

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Nova Conductors

Japan . 550 parts In-Stock

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$2.017

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$2.017

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Chip Stock

USA . 14,770 parts In-Stock

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Whistler Technology

UK . 150 parts In-Stock

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Vyrian

USA . 94 parts In-Stock

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Huijzer Components

Netherlands . 30 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 90 parts In-Stock

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$0.840

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90

$0.840

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Aztec Data Supply Inc.

USA . 230 parts In-Stock

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$1.030

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$1.030

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Ampacity Inc.

Singapore . 94 parts In-Stock

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$1.420

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Corphita

USA . 800 parts In-Stock

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$1.503

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$1.503

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Modulus Dynamics

Lithuania . 9,516 parts In-Stock

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$1.714

100+ parts

$1.645

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$1.577

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9,516

$1.714

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$1.577

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Continental Prestige Electronics

USA . 3,724 parts In-Stock

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$2.017

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$1.977

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$1.977

Argo Parts USA

USA . 892 parts In-Stock

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$2.017

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AZTECH Wire

Italy . 628 parts In-Stock

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$17.412

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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Perfect Parts

USA . 20,944 parts In-Stock

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Lixinc

USA . 15,205 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,994 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,858 parts In-Stock

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3,858

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Microchip USA

USA . 117 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Elevate your motor control systems with the IRG4BC30KDPBF Insulated Gate Bipolar Transistor from Infineon Technologies. Known for their high-quality components, Infineon delivers reliable performance and durability. This N-CHANNEL transistor offers a single configuration and is perfect for a wide range of motor control applications. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 100W, this transistor provides exceptional value and efficiency for your projects. Upgrade your systems today with the IRG4BC30KDPBF and experience the advantages of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel types, making them suitable for motor control applications.

Maximum Power Dissipation (Abs): 100 W

The high maximum power dissipation of 100 W allows the IGBT to handle high power loads efficiently, making it ideal for motor control applications.

Maximum Collector-Emitter Voltage: 600 V

With a maximum collector-emitter voltage of 600 V, this IGBT can be used in applications that require high voltage handling capabilities, such as motor control.

Maximum Collector Current (IC): 28 A

The high maximum collector current rating of 28 A enables this IGBT to handle high current loads, making it suitable for motor control applications.

Nominal Turn On Time (ton): 100 ns

The fast nominal turn on time of 100 ns allows for quick switching speeds, making this IGBT suitable for motor control applications that require precise and fast control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30KDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

120 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

370 ns

Nominal Turn On Time (ton):

100 ns

Trade Compliance

IRG4BC30KDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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