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IRG4PH20KPBF

Infineon Technologies

IRG4PH20KPBF by Infineon Technologies

IRG4PH20KPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max Collector-Emitter Voltage of 1200V and Max Power Dissipation of 24W. It is designed for POWER CONTROL applications, featuring a Nominal Turn Off Time of 720ns and Max Fall Time of 400ns. Ideal for high-power systems requiring efficient switching capabilities.

Median Price

$3.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Nova Conductors

Japan . 93 parts In-Stock

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$3.630

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Vyrian

USA . 776 parts In-Stock

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Digiode

USA . 31 parts In-Stock

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 288 parts In-Stock

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$1.050

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Modulus Dynamics

Lithuania . 1,325 parts In-Stock

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$3.630

100+ parts

$3.485

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$3.340

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Continental Prestige Electronics

USA . 3,201 parts In-Stock

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$3.630

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$3.557

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Argo Parts USA

USA . 205 parts In-Stock

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$3.630

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AZTECH Wire

Italy . 411 parts In-Stock

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$19.212

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Perfect Parts

USA . 2,324 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$3.557

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$3.449

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$3.376

500

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$3.557

$3.449

$3.376

Authorized Procurement Solutions

USA . 95 parts In-Stock

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GreenTree Electronics

Israel . 95 parts In-Stock

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Corphita

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Overview

Enhance the performance of your power control applications with the IRG4PH20KPBF from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in every product they release. This N-channel insulated gate bipolar transistor offers customers exceptional value with its high power dissipation capability, fast turn-on time, and wide operating temperature range. Whether you're working on industrial machinery, renewable energy systems, or automotive electronics, this IGBT is designed to deliver superior performance and efficiency. Upgrade your projects today with the IRG4PH20KPBF and experience the difference Infineon can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and management in electronic circuits.

Maximum Fall Time (tf): 400 ns

Fast fall time ensures quick switching and response times in power control applications.

Maximum Power Dissipation (Abs): 24 W

Capable of handling high power loads, making it suitable for power control applications.

Maximum Collector-Emitter Voltage: 1200 V

Can withstand high voltage levels, making it suitable for power control in high-demand scenarios.

Maximum Gate-Emitter Voltage: 20 V

Optimal gate-emitter voltage allows for efficient control and operation of the transistor.

Maximum Collector Current (IC): 11 A

Capable of handling high current levels, making it suitable for power control applications.

Nominal Turn On Time (ton): 51 ns

Fast turn on time ensures quick activation and response in power control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PH20KPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

400 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

720 ns

Nominal Turn On Time (ton):

51 ns

Trade Compliance

IRG4PH20KPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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