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AIKW75N60CTXKSA1

Infineon Technologies

AIKW75N60CTXKSA1 by Infineon Technologies

AIKW75N60CTXKSA1 by Infineon Technologies is an N-Channel IGBT with a max VCEsat of 2V and a max IC of 80A. It is designed for power control applications, featuring a nominal toff of 365ns and ton of 69ns. The transistor operates at temperatures ranging from -40°C to 175°C, making it suitable for high-power industrial systems.

Median Price

$7.497

Lifecycle Status

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8

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1k+

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RS (Exports)

UK . 5 parts In-Stock

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$2.430

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$2.430

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Mouser Electronics

USA . 1,890 parts In-Stock

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$7.550

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$4.720

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$4.710

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$7.550

$4.720

$4.710

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Chip1Stop

Japan . 169 parts In-Stock

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$10.700

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$7.740

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$6.880

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$10.700

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Verical

USA . 16,080 parts In-Stock

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$7.444

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$5.378

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$5.378

Distributors (In-Stock)

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Digiode

USA . 426 parts In-Stock

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$9.500

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

USA . 4,353 parts In-Stock

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VNN

France . 61 parts In-Stock

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Corohmni

South Africa . 12 parts In-Stock

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$1.298

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Aztec Data Supply Inc.

USA . 46,373 parts In-Stock

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$1.520

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$1.520

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Modulus Dynamics

Lithuania . 9,419 parts In-Stock

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$1.958

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$1.880

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$1.801

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Ampacity Inc.

Singapore . 4,141 parts In-Stock

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$7.460

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Allen Electronics Distributors

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$8.030

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Corphita

USA . 105 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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$9.310

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$8.938

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Continental Prestige Electronics

USA . 810 parts In-Stock

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$9.500

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$9.310

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Component Stockers USA

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$11.620

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Semicontronic

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$16.230

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$15.824

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$15.743

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Microchip USA

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$36.848

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Advanced Electronics

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Argo Parts USA

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

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Overview

Experience the power of cutting-edge technology with the AIKW75N60CTXKSA1 by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability in their products. This Insulated Gate Bipolar Transistor (IGBT) is designed for power control applications, offering incredible efficiency and performance. With its single configuration and built-in diode, this transistor provides seamless operation and ease of use. Trust in the AIKW75N60CTXKSA1 to deliver exceptional results, making it the ideal choice for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliable performance.

Polarity or Channel Type: N-Channel

N-Channel IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-Channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and enhances efficiency in power control applications.

Maximum VCEsat: 2 V

Low VCEsat value indicates minimal power loss across the transistor, leading to higher efficiency in power control.

Package Shape: RECTANGULAR

Rectangular shape allows for easier mounting and integration into various systems.

Nominal Turn Off Time (toff): 365 ns

Fast turn-off time helps in reducing switching losses and improves overall system performance.

Maximum Power Dissipation (Abs): 428 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating.

Maximum Operating Temperature: 175 °C

Wide temperature range ensures stable operation in various environments.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating enables the transistor to handle high voltage loads safely.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating for effective control over the switching behavior of the IGBT.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle high current levels without damage.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Threshold voltage helps in controlling the turn-on behavior of the IGBT for precise power control.

Nominal Turn On Time (ton): 69 ns

Fast turn-on time aids in rapid switching and efficient power control applications.

Reference Standard: AEC-Q101

Compliance with automotive quality standard ensures reliability and performance in automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AIKW75N60CTXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

365 ns

Nominal Turn On Time (ton):

69 ns

Maximum VCEsat:

2 V

Trade Compliance

AIKW75N60CTXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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