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FP100R12KT4B11BOSA1

Infineon Technologies

FP100R12KT4B11BOSA1 by Infineon Technologies

Infineon's FP100R12KT4B11BOSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 620ns turn-off time, and 210ns turn-on time. Its complex configuration and isolated case connection make it ideal for high-power applications in industries like automotive and renewable energy.

Median Price

$189.000

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 29 parts In-Stock

1+ parts

$111.870

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-

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29

$111.870

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-

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Farnell

UK . 1 parts In-Stock

1+ parts

$124.690

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-

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1

$124.690

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Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$189.000

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10

$189.000

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Verical

USA . 10 parts In-Stock

1+ parts

$197.000

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-

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10

$197.000

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Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$218.710

100+ parts

$197.140

1k+ parts

$197.140

10k+ parts

$197.140

7

$218.710

$197.140

$197.140

$197.140

Rochester

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$94.520

1k+ parts

$84.570

10k+ parts

$79.590

47

-

$94.520

$84.570

$79.590

RS (Exports)

UK . 9 parts In-Stock

1+ parts

-

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$293.821

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-

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9

-

$293.821

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Distributors (In-Stock)

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Digiode

USA . 598 parts In-Stock

1+ parts

$116.945

100+ parts

-

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598

$116.945

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$199.421

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10

$199.421

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$290.270

100+ parts

$262.390

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100

$290.270

$262.390

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Vyrian

USA . 2,434 parts In-Stock

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2,434

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 18,351 parts In-Stock

1+ parts

$0.559

100+ parts

$0.537

1k+ parts

$0.514

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-

18,351

$0.559

$0.537

$0.514

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Aztec Data Supply Inc.

USA . 1,133 parts In-Stock

1+ parts

$1.009

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1,133

$1.009

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Corohmni

South Africa . 333 parts In-Stock

1+ parts

$1.505

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333

$1.505

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.616

100+ parts

$1.535

1k+ parts

$1.535

10k+ parts

-

450

$1.616

$1.535

$1.535

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$14.960

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765

$14.960

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Semicontronic

India . 18 parts In-Stock

1+ parts

$104.630

100+ parts

$102.014

1k+ parts

$101.491

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-

18

$104.630

$102.014

$101.491

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Ampacity Inc.

Singapore . 17 parts In-Stock

1+ parts

$104.630

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17

$104.630

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Continental Prestige Electronics

USA . 6 parts In-Stock

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$107.370

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6

$107.370

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Corphita

USA . 709 parts In-Stock

1+ parts

$110.790

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709

$110.790

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$199.421

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1,000

$199.421

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QUARKTWIN TECHNOLOGY LTD

USA . 22,576 parts In-Stock

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22,576

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Microchip USA

USA . 10,047 parts In-Stock

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10,047

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Argo Parts USA

USA . 3,707 parts In-Stock

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3,707

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Unleash the power of cutting-edge technology with the FP100R12KT4B11BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies sets the standard for quality and innovation. This Insulated Gate Bipolar Transistor boasts superior performance and reliability, making it ideal for a wide range of applications. From industrial machinery to renewable energy systems, this N-CHANNEL transistor offers unparalleled efficiency and precision. Experience the value and benefits of Infineon's FP100R12KT4B11BOSA1, and take your projects to new heights with confidence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

This allows for efficient control and power handling capabilities, making it suitable for a wide range of applications.

Configuration: COMPLEX

The complex configuration of this IGBT enhances performance and efficiency in complex circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into circuit boards and helps in space-saving applications.

No. of Elements: 7

With 7 elements, this IGBT offers high power handling capacity and improved reliability in demanding environments.

Nominal Turn Off Time (toff): 620 ns

The fast turn-off time ensures quick switching speeds, reducing power losses and improving overall efficiency.

No. of Terminals: 35

The high number of terminals allows for versatile connectivity options, catering to a wide range of circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables secure and stable mounting, ideal for rugged industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can handle high power levels without risking damage to the system.

Transistor Element Material: SILICON

The silicon material used in the transistor element provides excellent performance and durability, ensuring long-term reliability.

Terminal Position: UPPER

The upper terminal position simplifies installation and connection processes, making integration into circuits more convenient.

Case Connection: ISOLATED

The isolated case connection enhances safety and reliability by preventing potential short circuits and electrical hazards.

Nominal Turn On Time (ton): 210 ns

The fast turn-on time results in quick response times, making this IGBT suitable for high-speed switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP100R12KT4B11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

FP100R12KT4B11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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