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FP100R06KE3BOSA1

Infineon Technologies

FP100R06KE3BOSA1 by Infineon Technologies

FP100R06KE3BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V. It has a nominal turn-off time of 820ns and a nominal turn-on time of 170ns. This IGBT is commonly used in applications requiring high power switching, such as motor drives and power supplies.

Median Price

$123.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 10 parts In-Stock

1+ parts

$61.990

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-

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10

$61.990

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DigiKey

USA . 9 parts In-Stock

1+ parts

$102.940

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9

$102.940

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Verical

USA . 10 parts In-Stock

1+ parts

$143.280

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10

$143.280

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Chip1Stop

Japan . 10 parts In-Stock

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$147.000

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10

$147.000

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Distributors (In-Stock)

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Digiode

USA . 922 parts In-Stock

1+ parts

$99.988

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-

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922

$99.988

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Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$141.100

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78

$141.100

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Vyrian

USA . 2,900 parts In-Stock

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2,900

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Chip Stock

USA . 945 parts In-Stock

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945

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Distributors (Availability)

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.422

100+ parts

$0.401

1k+ parts

$0.401

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-

50

$0.422

$0.401

$0.401

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Aztec Data Supply Inc.

USA . 319 parts In-Stock

1+ parts

$0.570

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-

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319

$0.570

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Corohmni

South Africa . 374 parts In-Stock

1+ parts

$1.538

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374

$1.538

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Modulus Dynamics

Lithuania . 9,153 parts In-Stock

1+ parts

$1.738

100+ parts

$1.668

1k+ parts

$1.599

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-

9,153

$1.738

$1.668

$1.599

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AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$15.995

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190

$15.995

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Ampacity Inc.

Singapore . 25 parts In-Stock

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$89.460

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25

$89.460

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Corphita

USA . 284 parts In-Stock

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$94.725

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284

$94.725

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Semicontronic

India . 13 parts In-Stock

1+ parts

$109.120

100+ parts

$106.392

1k+ parts

$105.846

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13

$109.120

$106.392

$105.846

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Bastille Electronics

Australia . 700 parts In-Stock

1+ parts

$141.100

100+ parts

$134.045

1k+ parts

-

10k+ parts

$125.579

700

$141.100

$134.045

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$125.579

Continental Prestige Electronics

USA . 5,239 parts In-Stock

1+ parts

$141.100

100+ parts

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$138.278

5,239

$141.100

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$138.278

Microchip USA

USA . 2,846 parts In-Stock

1+ parts

$301.695

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2,846

$301.695

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QUARKTWIN TECHNOLOGY LTD

USA . 9,842 parts In-Stock

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9,842

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Argo Parts USA

USA . 2,253 parts In-Stock

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2,253

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Overview

Experience the power of the FP100R06KE3BOSA1 by Infineon Technologies, a game-changing Insulated Gate Bipolar Transistor (IGBT). With its N-CHANNEL polarity and COMPLEX configuration, this rectangular package boasts 7 elements and 24 terminals, offering unrivaled performance. Whether used in industrial machinery or renewable energy systems, this IGBT delivers seamless operation with a nominal turn-off time of 820 ns and turn-on time of 170 ns. Backed by Infineon's renowned quality and expertise, this product ensures maximum reliability even in the harshest conditions. Discover the value, benefits, and advantages that the FP100R06KE3BOSA1 brings to your applications today!

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - This product's N-channel polarity design allows for improved efficiency and better control of current flow, making it a reliable choice for high-performance applications.

Configuration:

COMPLEX - With a complex configuration, this IGBT provides enhanced functionality and flexibility, making it suitable for a wide range of demanding tasks.

Package Shape:

RECTANGULAR - The rectangular package shape ensures easy installation and compatibility with standard mounting techniques, making it a convenient choice for various applications.

No. of Elements:

7 - The inclusion of 7 elements in this IGBT promotes high power handling capacity and overall reliability, making it suitable for heavy-duty applications.

Nominal Turn Off Time (toff):

820 ns - The nominal turn off time of 820 ns allows for efficient switching and reduced power loss, resulting in improved overall performance and energy efficiency.

No. of Terminals:

24 - With 24 terminals, this IGBT offers increased connectivity options and better overall control, making it ideal for complex circuitry and diverse applications.

Package Style (Meter):

FLANGE MOUNT - The flange mount package style enables secure and stable mounting, enhancing durability and thermal management, making it a perfect fit for demanding industrial environments.

Maximum Operating Temperature:

175 °C - With a maximum operating temperature of 175°C, this IGBT can withstand higher heat levels without compromising performance and reliability, ensuring long-lasting operation even in harsh conditions.

Maximum Collector-Emitter Voltage:

600 V - The high maximum collector-emitter voltage of 600 V allows for greater voltage handling capacity, making this IGBT suitable for a wide range of high-power applications.

Transistor Element Material:

SILICON - The use of silicon as the transistor element material provides excellent electrical performance and reliability, making this IGBT a dependable choice for demanding applications.

Terminal Position:

UPPER - The upper terminal position facilitates efficient wiring and installation, ensuring convenience and ease of use in various systems and setups.

Case Connection:

ISOLATED - The isolated case connection offers electrical safety and protection, minimizing the risk of short circuits and improving overall system reliability, making it a trustworthy choice for critical applications.

Nominal Turn On Time (ton):

170 ns - With a nominal turn on time of 170 ns, this IGBT enables quick and efficient switching, resulting in faster response times and improved system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP100R06KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

820 ns

Nominal Turn On Time (ton):

170 ns

Trade Compliance

FP100R06KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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