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NGTB15N120LWG

Onsemi

NGTB15N120LWG by Onsemi

NGTB15N120LWG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 30A max collector current, and 229W max power dissipation. Ideal for motor control applications due to its single configuration with built-in diode and fast turn-off time of 435ns.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$2.890

100+ parts

-

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$1.980

10k+ parts

$1.550

36

$2.890

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$1.980

$1.550

DigiKey

USA . 6,987 parts In-Stock

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$1.560

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6,987

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$1.560

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Farnell

UK . 6,987 parts In-Stock

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$2.100

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6,987

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$2.100

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Rochester

USA . 4,987 parts In-Stock

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$1.340

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$1.200

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$1.130

4,987

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$1.340

$1.200

$1.130

Verical

USA . 2,470 parts In-Stock

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$1.500

10k+ parts

$1.413

2,470

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$1.500

$1.413

Distributors (In-Stock)

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Digiode

USA . 2,043 parts In-Stock

1+ parts

$1.425

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2,043

$1.425

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Nova Conductors

Japan . 900 parts In-Stock

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$2.003

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900

$2.003

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Vyrian

USA . 4,700 parts In-Stock

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4,700

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ACDS - Activité Composants Distribution Service

France . 180 parts In-Stock

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180

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Bristol Electronics

USA . 180 parts In-Stock

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180

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Dan-Mar Components

USA . 180 parts In-Stock

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180

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,844 parts In-Stock

1+ parts

$1.270

100+ parts

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3,844

$1.270

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Corphita

USA . 418 parts In-Stock

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$1.350

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418

$1.350

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Corohmni

South Africa . 209 parts In-Stock

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$1.500

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209

$1.500

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Aztec Data Supply Inc.

USA . 341 parts In-Stock

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$1.820

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341

$1.820

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Aranea Global

USA . 2,000 parts In-Stock

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$1.962

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$1.884

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2,000

$1.962

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$1.884

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Argo Parts USA

USA . 4,086 parts In-Stock

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$2.003

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Microchip USA

USA . 297 parts In-Stock

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$9.360

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297

$9.360

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Continental Prestige Electronics

USA . 8,065 parts In-Stock

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$1.810

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$1.810

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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TANS Electronics

Latvia . 5,270 parts In-Stock

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5,270

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A-Z Elektronik GmbH

Germany . 5,247 parts In-Stock

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SupplyDigital Components

Austria . 5,056 parts In-Stock

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Problanco Electronics

Mexico . 1,890 parts In-Stock

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Kulean Microsystems

USA . 1,557 parts In-Stock

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Kepictronics

USA . 1,280 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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765

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Perfect Parts

USA . 528 parts In-Stock

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528

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Overview

Unleash the power of your motor control systems with the NGTB15N120LWG by Onsemi. As a leading manufacturer in the industry, Onsemi is dedicated to providing high-quality Insulated Gate Bipolar Transistors (IGBT) for various applications. With a single configuration and built-in diode, this transistor offers exceptional performance and reliability. Whether you're looking to optimize efficiency or improve functionality, the NGTB15N120LWG delivers unmatched value and benefits to customers. Upgrade your systems today and experience the advantages of this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IGBT, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and ensures efficient energy transfer during operation.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring reliable performance and precise control.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and stable connection for the IGBT in various circuit configurations.

Nominal Turn Off Time (toff): 435 ns

The fast turn-off time ensures efficient switching and reduces power losses in the circuit.

No. of Terminals: 3

The 3 terminals provide flexibility in circuit connections and enable a wide range of applications.

Maximum Power Dissipation (Abs): 229 W

The high power dissipation capacity allows the IGBT to handle heavy loads and high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount design allows for easy installation and heat dissipation in demanding environments.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, the IGBT can function effectively in harsh conditions without overheating.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating ensures reliable operation in high-voltage applications.

Transistor Element Material: SILICON

Silicon is a proven semiconductor material known for its high performance and reliability in electronic devices.

Maximum Gate-Emitter Voltage: 20 V

The gate-emitter voltage rating ensures proper gate control, enabling precise switching and operation.

Maximum Collector Current (IC): 30 A

With a high collector current rating, the IGBT can handle large current loads without compromising performance.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage ensures proper gate control and reliable operation of the IGBT.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures long-term reliability in various environments.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and ensures easy integration into electronic systems.

Case Connection: COLLECTOR

The collector case connection allows for efficient heat dissipation and improves the overall performance of the IGBT.

Nominal Turn On Time (ton): 91 ns

The fast turn-on time enables quick response and precise control in motor control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB15N120LWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

435 ns

Nominal Turn On Time (ton):

91 ns

Trade Compliance

NGTB15N120LWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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