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BSM50GP120BOSA1

Infineon Technologies

BSM50GP120BOSA1 by Infineon Technologies

Infineon Technologies' BSM50GP120BOSA1 is an N-CHANNEL IGBT with 7 elements, 35 terminals, and a max collector-emitter voltage of 1200V. It has a nominal turn-off time of 430ns and a max operating temperature of 150°C. Ideal for applications requiring high current handling capabilities in complex configurations.

Median Price

$340.369

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 87 parts In-Stock

1+ parts

$302.550

100+ parts

$284.400

1k+ parts

$266.240

10k+ parts

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87

$302.550

$284.400

$266.240

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Verical

USA . 87 parts In-Stock

1+ parts

$378.188

100+ parts

$355.500

1k+ parts

$332.800

10k+ parts

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87

$378.188

$355.500

$332.800

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$295.800

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900

$295.800

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Digiode

USA . 102 parts In-Stock

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$334.562

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102

$334.562

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Vyrian

USA . 5,569 parts In-Stock

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5,569

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VNN

France . 1,985 parts In-Stock

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1,985

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Distributors (Availability)

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Corohmni

South Africa . 103 parts In-Stock

1+ parts

$0.319

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-

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103

$0.319

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Modulus Dynamics

Lithuania . 21,073 parts In-Stock

1+ parts

$1.492

100+ parts

$1.432

1k+ parts

$1.373

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21,073

$1.492

$1.432

$1.373

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Aztec Data Supply Inc.

USA . 310 parts In-Stock

1+ parts

$1.710

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310

$1.710

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AZTECH Wire

Italy . 574 parts In-Stock

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$5.517

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574

$5.517

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Continental Prestige Electronics

USA . 2,273 parts In-Stock

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$295.800

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$289.884

2,273

$295.800

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-

$289.884

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$295.800

100+ parts

-

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$281.010

10k+ parts

$275.094

1,000

$295.800

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$281.010

$275.094

Ampacity Inc.

Singapore . 94 parts In-Stock

1+ parts

$299.340

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94

$299.340

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Semicontronic

India . 94 parts In-Stock

1+ parts

$299.340

100+ parts

$291.856

1k+ parts

$290.360

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94

$299.340

$291.856

$290.360

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Corphita

USA . 199 parts In-Stock

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$316.953

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199

$316.953

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Microchip USA

USA . 5,261 parts In-Stock

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$370.830

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5,261

$370.830

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Argo Parts USA

USA . 3,153 parts In-Stock

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock the power of high-quality technology with the BSM50GP120BOSA1 from Infineon Technologies. As a leader in the industry, Infineon offers top-notch Insulated Gate Bipolar Transistors that are versatile and reliable. This N-CHANNEL transistor boasts a complex configuration, making it perfect for a wide range of applications. With fast turn-off and turn-on times, this product provides exceptional performance and efficiency. Trust in the value and benefits that Infineon brings to the table, and experience the advantages of the BSM50GP120BOSA1 for yourself.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses and faster switching speeds compared to P-channel IGBTs, making this product suitable for high efficiency applications.

Configuration: COMPLEX

Complex configuration allows for optimized performance and functionality in various circuit design applications, providing versatility and efficiency.

Nominal Turn Off Time (toff): 430 ns

Fast turn-off time helps in reducing switching losses and increasing efficiency in high frequency and high power applications.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for use in applications requiring high voltage levels, making this IGBT versatile and suitable for a wide range of applications.

Maximum Collector Current (IC): 80 A

High collector current rating enables the IGBT to handle high current levels, making it suitable for power electronics applications that require high current handling capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM50GP120BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

JESD-609 Code:

e3

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

430 ns

Nominal Turn On Time (ton):

105 ns

Trade Compliance

BSM50GP120BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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