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HGTG30N60C3D

Onsemi

HGTG30N60C3D by Onsemi

HGTG30N60C3D by Onsemi is an N-CHANNEL IGBT with 600V VCE, 63A IC, and 550ns toff. Ideal for MOTOR CONTROL applications due to its SINGLE configuration with BUILT-IN DIODE. Package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

$6.120

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$0.791

100+ parts

$0.720

1k+ parts

$0.649

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450

$0.791

$0.720

$0.649

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Arrow

USA . 77 parts In-Stock

1+ parts

$4.703

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77

$4.703

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Chip1Stop

Japan . 171 parts In-Stock

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$6.250

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$6.250

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Rochester

USA . 5,413 parts In-Stock

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$5.990

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$5.360

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$5.050

5,413

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$5.990

$5.360

$5.050

DigiKey

USA . 5,413 parts In-Stock

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$7.890

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5,413

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$7.890

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Verical

USA . 5,250 parts In-Stock

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$7.487

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$6.700

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$6.313

5,250

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$7.487

$6.700

$6.313

Flip Electronics (Authorized)

USA . 900 parts In-Stock

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900

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Distributors (In-Stock)

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Digiode

USA . 2,082 parts In-Stock

1+ parts

$0.751

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2,082

$0.751

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Nova Conductors

Japan . 650 parts In-Stock

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$6.279

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650

$6.279

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Bristol Electronics

USA . 45 parts In-Stock

1+ parts

$7.872

100+ parts

$4.920

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45

$7.872

$4.920

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Galco

USA . 5 parts In-Stock

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$8.570

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5

$8.570

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Greenchips

USA . 31,500 parts In-Stock

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31,500

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ComSIT Distribution GmbH

Germany . 3,215 parts In-Stock

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ComSIT USA

USA . 3,215 parts In-Stock

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Vyrian

USA . 2,820 parts In-Stock

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North Shore Components

USA . 1,069 parts In-Stock

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1,069

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Flip Electronics

USA . 780 parts In-Stock

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780

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Dan-Mar Components

USA . 645 parts In-Stock

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645

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Sunrise Surplus Inc.

USA . 373 parts In-Stock

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373

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Jameco Electronics

USA . 186 parts In-Stock

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Classic Components Corporation

USA . 59 parts In-Stock

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Pegasus Components GmbH

Germany . 48 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 40 parts In-Stock

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40

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Electronic Expediters

USA . 20 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 11 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,973 parts In-Stock

1+ parts

$0.712

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1,973

$0.712

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.791

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$0.720

1k+ parts

$0.649

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450

$0.791

$0.720

$0.649

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Corohmni

South Africa . 266 parts In-Stock

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$0.791

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266

$0.791

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Component Stockers USA

USA . 8,517 parts In-Stock

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$3.800

100+ parts

$6.030

1k+ parts

$5.750

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8,517

$3.800

$6.030

$5.750

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Continental Prestige Electronics

USA . 3,824 parts In-Stock

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$6.120

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$5.997

3,824

$6.120

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Netroflash

USA . 1,000 parts In-Stock

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$6.279

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 5,306 parts In-Stock

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Kulean Microsystems

USA . 5,220 parts In-Stock

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Supply Digital

USA . 3,684 parts In-Stock

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3,684

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Problanco Electronics

Mexico . 2,550 parts In-Stock

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SupplyDigital Components

Austria . 2,522 parts In-Stock

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TANS Electronics

Latvia . 1,822 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Perfect Parts

USA . 1,400 parts In-Stock

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Argo Parts USA

USA . 1,321 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 335 parts In-Stock

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Overview

Unlock the power of precision motor control with the HGTG30N60C3D by Onsemi. Crafted with superior quality and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers unmatched reliability and performance for your applications. Whether you're looking to enhance efficiency in industrial machinery or elevate the performance of renewable energy systems, this N-CHANNEL transistor with a built-in diode is the perfect choice. Get ready to experience seamless operation and optimized functionality with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and ruggedness are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-resistance and higher efficiency compared to P-channel, making them suitable for high power applications such as motor control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, increasing the reliability and performance of the IGBT.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, ensuring optimized performance and efficiency in driving motors.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong mechanical connection, making it suitable for applications where vibration or mechanical stress is a concern.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT can handle high voltage applications with ease, providing a reliable and safe operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTG30N60C3D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

550 ns

Nominal Turn On Time (ton):

85 ns

Trade Compliance

HGTG30N60C3D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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