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HGTG40N60B3

Onsemi

HGTG40N60B3 by Onsemi

HGTG40N60B3 by Onsemi is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 70A. It has a nominal turn-off time of 385ns and a turn-on time of 82ns, making it ideal for power control applications requiring fast switching speeds. The package style is flange mount with through-hole terminals, suitable for high-power applications operating at temperatures up to 150°C.

Median Price

$10.601

Lifecycle Status

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11

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Nova Conductors

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Freelance Electronics

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Vyrian

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Digiode

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ComSIT Distribution GmbH

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J & M Industries LLC

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MISTER SPROCKETS

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Component Sense

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LittleDiode

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 860 parts In-Stock

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$1.497

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Corohmni

South Africa . 266 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Continental Prestige Electronics

USA . 614 parts In-Stock

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$5.651

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AZTECH Wire

Italy . 812 parts In-Stock

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Ampacity Inc.

Singapore . 1,350 parts In-Stock

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Semicontronic

India . 920 parts In-Stock

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$52.699

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Authorized Procurement Solutions

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TANS Electronics

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Problanco Electronics

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Metaverse IC Inc.

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Alle Elektronik GmbH

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SupplyDigital Components

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Perfect Parts

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A-Z Elektronik GmbH

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Argo Parts USA

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Kulean Microsystems

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Overview

Upgrade your power control systems with the HGTG40N60B3 from Onsemi, a top-tier manufacturer of Insulated Gate Bipolar Transistors (IGBT). Designed for maximum efficiency and reliability, this N-channel transistor offers high performance in a wide range of applications. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of just 385ns, this single configuration transistor delivers unparalleled power control capabilities. Trust Onsemi's reputation for quality and experience the value and benefits of the HGTG40N60B3 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties, making the transistor safer to use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product suitable for power control applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity in power control systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and reliable performance in controlling power circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and installation in various electronic devices and systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in a wide range of environments without risk of overheating.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating enables the transistor to be used in high-power applications, providing better control and stability.

Maximum Collector Current (IC): 70 A

High collector current rating allows for the handling of large currents, making this transistor suitable for power control in heavy-duty applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTG40N60B3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

385 ns

Nominal Turn On Time (ton):

82 ns

Trade Compliance

HGTG40N60B3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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