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FS25R12W1T4BOMA1

Infineon Technologies

FS25R12W1T4BOMA1 by Infineon Technologies

FS25R12W1T4BOMA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V and a nominal turn off time of 505ns, making it ideal for power control applications. With a max collector current of 45A and operating temperature of up to 175°C, this IGBT is designed for high-power industrial systems.

Median Price

$27.330

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 21 parts In-Stock

1+ parts

$9.710

100+ parts

-

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-

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21

$9.710

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Farnell

UK . 96 parts In-Stock

1+ parts

$27.330

100+ parts

$17.570

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-

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96

$27.330

$17.570

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Chip1Stop

Japan . 18 parts In-Stock

1+ parts

$33.400

100+ parts

$26.700

1k+ parts

$26.400

10k+ parts

-

18

$33.400

$26.700

$26.400

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Element14

Singapore . 96 parts In-Stock

1+ parts

$45.910

100+ parts

$29.900

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96

$45.910

$29.900

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Master Electronics

USA . 24 parts In-Stock

1+ parts

$53.370

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24

$53.370

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Rochester

USA . 24 parts In-Stock

1+ parts

-

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$19.860

1k+ parts

$17.770

10k+ parts

$16.720

24

-

$19.860

$17.770

$16.720

DigiKey

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$26.130

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24

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$26.130

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Verical

USA . 18 parts In-Stock

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18

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Distributors (In-Stock)

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Digiode

USA . 755 parts In-Stock

1+ parts

$9.224

100+ parts

-

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755

$9.224

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$39.020

100+ parts

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72

$39.020

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Vyrian

USA . 2,461 parts In-Stock

1+ parts

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2,461

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TME

Poland . 424 parts In-Stock

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$26.460

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424

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$26.460

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NAC Semi

USA . 240 parts In-Stock

1+ parts

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100+ parts

$70.050

1k+ parts

$63.040

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240

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$70.050

$63.040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 884 parts In-Stock

1+ parts

$0.722

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884

$0.722

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Modulus Dynamics

Lithuania . 18,440 parts In-Stock

1+ parts

$1.724

100+ parts

$1.655

1k+ parts

$1.586

10k+ parts

-

18,440

$1.724

$1.655

$1.586

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Aztec Data Supply Inc.

USA . 215 parts In-Stock

1+ parts

$1.787

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215

$1.787

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Ampacity Inc.

Singapore . 71 parts In-Stock

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$8.250

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71

$8.250

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Corphita

USA . 274 parts In-Stock

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$8.739

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274

$8.739

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AZTECH Wire

Italy . 286 parts In-Stock

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$14.674

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286

$14.674

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Continental Prestige Electronics

USA . 5,125 parts In-Stock

1+ parts

$39.020

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$38.240

5,125

$39.020

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$38.240

Netroflash

USA . 1,000 parts In-Stock

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$39.020

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$38.240

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1,000

$39.020

$38.240

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Microchip USA

USA . 3,818 parts In-Stock

1+ parts

$94.553

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3,818

$94.553

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A-Z Elektronik GmbH

Germany . 5,090 parts In-Stock

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5,090

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 3,969 parts In-Stock

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3,969

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Alle Elektronik GmbH

Germany . 3,393 parts In-Stock

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3,393

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Overview

Unlock the power of the FS25R12W1T4BOMA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality Insulated Gate Bipolar Transistors (IGBT). With its N-CHANNEL polarity and BRIDGE configuration, this transistor is designed for POWER CONTROL applications, offering unparalleled performance and reliability. Featuring 6 elements with built-in diode and thermistor, this product ensures optimal functionality and ease of use. Whether you're looking to enhance efficiency or streamline your operations, the FS25R12W1T4BOMA1 provides unmatched value and benefits, making it the ideal choice for your next project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and faster switching speed compared to P-CHANNEL, making them suitable for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor help in protecting the circuit from reverse current and over temperature, improving the reliability of the power control system.

Maximum Collector-Emitter Voltage: 1200 V

With a high voltage rating, this IGBT can handle high power applications without the risk of breakdown, ensuring stable operation in demanding conditions.

Maximum Collector Current (IC): 45 A

The high collector current rating allows this IGBT to handle large current loads, making it suitable for power control applications that require high current capacity.

Nominal Turn On Time (ton): 80 ns

The fast turn on time ensures quick response of the IGBT in switching operations, reducing switching losses and improving efficiency of the power control system.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS25R12W1T4BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

6

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

505 ns

Nominal Turn On Time (ton):

80 ns

Trade Compliance

FS25R12W1T4BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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