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FS25R12W1T4B11BOMA1

Infineon Technologies

FS25R12W1T4B11BOMA1 by Infineon Technologies

Infineon FS25R12W1T4B11BOMA1 is an N-CHANNEL IGBT with 1200V VCE, 45A IC, and 205W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 505ns and UL approval. Operating from -40°C to 150°C, it features a complex configuration in a rectangular package with flange mount style.

Median Price

$27.840

Lifecycle Status

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12

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1k+

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RS (Exports)

UK . 63 parts In-Stock

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$27.840

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$23.480

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63

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DigiKey

USA . 21 parts In-Stock

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$31.200

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$20.855

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$19.848

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21

$31.200

$20.855

$19.848

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Chip1Stop

Japan . 24 parts In-Stock

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$31.600

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EBV Elektronik

Germany . 456 parts In-Stock

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Rochester

USA . 79 parts In-Stock

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$19.860

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$17.770

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$16.720

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$16.720

Verical

USA . 79 parts In-Stock

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-

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$24.825

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$22.212

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$20.900

79

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$20.900

Distributors (In-Stock)

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Digiode

USA . 647 parts In-Stock

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$23.788

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$23.788

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TodayComponents

USA . 100 parts In-Stock

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$39.100

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$35.350

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$39.100

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Vyrian

USA . 8,686 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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TME

Poland . 466 parts In-Stock

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$25.880

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NAC Semi

USA . 360 parts In-Stock

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$60.600

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$55.090

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Aztec Data Supply Inc.

USA . 3,550 parts In-Stock

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$1.334

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3,550

$1.334

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Advanced Electronics

New Zealand . 74 parts In-Stock

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$1.884

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$1.714

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$1.545

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74

$1.884

$1.714

$1.545

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AZTECH Wire

Italy . 258 parts In-Stock

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$10.637

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258

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Ampacity Inc.

Singapore . 36 parts In-Stock

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$21.280

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Corphita

USA . 412 parts In-Stock

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$22.536

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$22.536

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Continental Prestige Electronics

USA . 47 parts In-Stock

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$23.630

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$21.740

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$21.740

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Andel Nordic

Denmark . 89 parts In-Stock

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$33.560

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$23.491

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$23.491

89

$33.560

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$23.491

$23.491

Modulus Dynamics

Lithuania . 5,014 parts In-Stock

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$34.398

100+ parts

$33.022

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$31.646

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5,014

$34.398

$33.022

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Corohmni

South Africa . 487 parts In-Stock

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$34.398

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$34.398

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Semicontronic

India . 36 parts In-Stock

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$46.320

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$45.162

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$44.930

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QUARKTWIN TECHNOLOGY LTD

USA . 9,593 parts In-Stock

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Microchip USA

USA . 7,552 parts In-Stock

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Argo Parts USA

USA . 4,858 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the FS25R12W1T4B11BOMA1 by Infineon Technologies. As a leading manufacturer in the industry, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability for your power control applications. With a maximum VCEsat of 2.25 V and a maximum collector-emitter voltage of 1200 V, this N-CHANNEL transistor provides exceptional performance in a variety of settings. Experience the benefits of advanced technology and superior design with this complex configuration transistor, designed to optimize efficiency and power dissipation. Elevate your projects to new heights with the FS25R12W1T4B11BOMA1 and unlock a world of possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs are known for their high input impedance and low on-state voltage drop, making them ideal for high power applications.

Configuration: COMPLEX

Complex configuration allows for better control of power distribution and efficiency in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance in controlling power systems.

Maximum VCEsat: 2.25 V

Low VCEsat voltage helps minimize power loss and improve overall efficiency in power control circuits.

Package Shape: RECTANGULAR

Rectangular package shape offers easy mounting and installation in various electronic systems.

No. of Elements: 6

Having 6 elements provides increased functionality and flexibility in power control applications.

Nominal Turn Off Time (toff): 505 ns

Fast turn-off time ensures quick switching and efficient operation in power control scenarios.

No. of Terminals: 22

Higher number of terminals allow for more connections and versatility in circuit design and implementation.

Maximum Power Dissipation (Abs): 205 W

High power dissipation capability enables the IGBT to handle demanding power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting options for the IGBT in different systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage makes this IGBT suitable for high voltage power control applications.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power switching applications.

Maximum Gate-Emitter Voltage: 20 V

Safe maximum gate-emitter voltage ensures proper gate control and protection of the IGBT.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions, increasing the product's versatility.

Maximum Collector Current (IC): 45 A

High maximum collector current rating allows for handling of high power loads without issues.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Proper gate-emitter threshold voltage ensures efficient triggering and control of the IGBT.

Terminal Position: UPPER

Upper terminal position enables easier access and connection in circuit layouts.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference in power control systems.

Nominal Turn On Time (ton): 80 ns

Fast turn-on time improves the efficiency and speed of power switching operations.

Reference Standard: UL APPROVED

UL approval ensures compliance with safety and quality standards, making it a reliable choice for various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS25R12W1T4B11BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

6

No. of Terminals:

22

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

505 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FS25R12W1T4B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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