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FS25R12KT3BOSA1

Infineon Technologies

FS25R12KT3BOSA1 by Infineon Technologies

FS25R12KT3BOSA1 by Infineon is an N-CHANNEL IGBT with 6 elements in a BRIDGE configuration. It has a toff of 610 ns, ton of 140 ns, and can handle up to 40 A collector current. Ideal for applications requiring high voltage (1200 V) and temperature (150°C) operation such as power supplies and motor drives.

Median Price

$43.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Farnell

UK . 12 parts In-Stock

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$43.690

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$41.070

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Vyrian

USA . 6,185 parts In-Stock

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Digiode

USA . 555 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Corohmni

South Africa . 6 parts In-Stock

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$0.428

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6

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Modulus Dynamics

Lithuania . 15,288 parts In-Stock

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$1.565

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$1.502

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$1.440

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Aztec Data Supply Inc.

USA . 94 parts In-Stock

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$1.786

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Microchip USA

USA . 2,713 parts In-Stock

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$2.782

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AZTECH Wire

Italy . 553 parts In-Stock

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$6.628

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Ampacity Inc.

Singapore . 599 parts In-Stock

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$32.050

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Continental Prestige Electronics

USA . 12 parts In-Stock

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Component Stockers USA

USA . 333 parts In-Stock

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$99.990

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Aranea Global

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Argo Parts USA

USA . 787 parts In-Stock

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Corphita

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Overview

Unlock the power of Infineon Technologies' FS25R12KT3BOSA1 Insulated Gate Bipolar Transistor (IGBT) for your next project. With a robust design featuring 6 elements, built-in diode, and thermistor, this N-CHANNEL transistor offers unparalleled reliability and efficiency. Ideal for high-power applications, this IGBT can handle up to 40 A of current and a maximum voltage of 1200 V. Trust in the quality and innovation of Infineon Technologies to deliver superior performance and value, making the FS25R12KT3BOSA1 the perfect choice for your electronic needs.

Feature Benefit Bullets

Polarity: N-CHANNEL

Offers efficient power control, making it suitable for various industrial applications.

Configuration: BRIDGE, 6 ELEMENTS

Provides high voltage and power handling capabilities, ideal for use in motor drives and inverters.

Package Shape: RECTANGULAR

Allows for easy installation and heat dissipation, enhancing overall performance and reliability.

No. of Elements: 6

Increases power density and efficiency, making it a cost-effective solution for high-power applications.

Nominal Turn Off Time (toff): 610 ns

Ensures quick response and precise control, improving system efficiency and reliability.

No. of Terminals: 28

Offers versatile connection options, allowing for flexible integration into different circuit designs.

Package Style: FLANGE MOUNT

Provides secure mounting and thermal management, extending the product's lifespan.

Maximum Operating Temperature: 150 °C

Enables operation in harsh environments, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 1200 V

Ensures reliable operation at high voltages, making it suitable for power electronics applications.

Transistor Element Material: SILICON

Provides high switching speed and low conduction losses, improving overall efficiency.

Maximum Collector Current (IC): 40 A

Offers high current handling capabilities, making it suitable for power switching applications.

Terminal Position: UPPER

Facilitates easy connections and routing in the circuit layout, enhancing installation convenience.

Case Connection: ISOLATED

Ensures electrical insulation and safety, preventing damage from voltage spikes and short circuits.

Nominal Turn On Time (ton): 140 ns

Provides fast switching speeds, improving system response times and efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS25R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X28

No. of Elements:

6

No. of Terminals:

28

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Trade Compliance

FS25R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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