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IRG4PH30KDPBF

Infineon Technologies

IRG4PH30KDPBF by Infineon Technologies

IRG4PH30KDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 1200V and Max Power Dissipation of 100W. It is designed for MOTOR CONTROL applications, featuring a single configuration with built-in diode and fast switching times (tr: 84ns, tf: 140ns).

Median Price

$3.620

Lifecycle Status

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11

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1k+

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Rochester

USA . 13 parts In-Stock

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$3.620

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$3.400

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$3.070

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$3.070

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Nova Conductors

Japan . 450 parts In-Stock

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$1.670

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$1.670

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Digiode

USA . 528 parts In-Stock

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$3.439

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TME

Poland . 275 parts In-Stock

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ComSIT Distribution GmbH

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Chip Stock

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A&K Electronics

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Bristol Electronics

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Chris Electronics

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Continental Prestige Electronics

USA . 2,076 parts In-Stock

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$1.670

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$1.637

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$1.637

Argo Parts USA

USA . 1,749 parts In-Stock

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$1.670

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Netroflash

USA . 50 parts In-Stock

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$1.670

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$1.670

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Modulus Dynamics

Lithuania . 24,014 parts In-Stock

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$1.670

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$1.603

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$1.536

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24,014

$1.670

$1.603

$1.536

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Corohmni

South Africa . 548 parts In-Stock

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$1.670

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Advanced Electronics

New Zealand . 96 parts In-Stock

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$1.724

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$1.569

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$1.414

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Aztec Data Supply Inc.

USA . 4,414 parts In-Stock

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$1.917

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Ampacity Inc.

Singapore . 13 parts In-Stock

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$3.080

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Semicontronic

India . 13 parts In-Stock

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$3.080

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$3.003

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$2.988

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Corphita

USA . 126 parts In-Stock

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$3.258

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AZTECH Wire

Italy . 563 parts In-Stock

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Component Stockers USA

USA . 763 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,197 parts In-Stock

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Microchip USA

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Alle Elektronik GmbH

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Perfect Parts

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Overview

Unlock the potential of your motor control applications with the high-quality IRG4PH30KDPBF Insulated Gate Bipolar Transistor by Infineon Technologies. Designed for efficiency and reliability, this N-channel transistor features a built-in diode for seamless performance. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 100W, this transistor offers unmatched value and benefits for your projects. Trust in Infineon Technologies for top-of-the-line components that deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IGBT, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state voltage drop and higher switching speeds, making them ideal for motor control applications where efficiency is important.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects the IGBT from voltage spikes, improving overall reliability and efficiency of the motor control system.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in controlling the speed and direction of motors.

Maximum Power Dissipation (Abs): 100 W

High power dissipation capability allows the IGBT to handle high power levels without overheating, making it suitable for demanding motor control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PH30KDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

140 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

84 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

637 ns

Nominal Turn On Time (ton):

121 ns

Trade Compliance

IRG4PH30KDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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