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HGTG12N60A4D

Onsemi

HGTG12N60A4D by Onsemi

HGTG12N60A4D by Onsemi is an N-CHANNEL IGBT with 600V VCE, 54A IC, and 2.7V VCEsat. Ideal for POWER CONTROL applications due to its built-in diode and fast switching times (toff:180ns, tf:95ns). Suitable for high-power systems operating in temperatures ranging from -55°C to 150°C.

Median Price

$2.610

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 368 parts In-Stock

1+ parts

$2.610

100+ parts

$2.450

1k+ parts

$2.220

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368

$2.610

$2.450

$2.220

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Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

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$1.966

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38

$1.966

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Digiode

USA . 2,693 parts In-Stock

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$2.480

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2,693

$2.480

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Chip Stock

USA . 3,382 parts In-Stock

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Vyrian

USA . 2,645 parts In-Stock

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Partservice

France . 30 parts In-Stock

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$4.583

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$4.583

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$4.583

30

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$4.583

$4.583

$4.583

Micros sp.j. W. Kędra i J. Lic

Poland . 30 parts In-Stock

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-

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$4.910

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$4.910

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$4.910

30

-

$4.910

$4.910

$4.910

LIBRA Elektronik GmbH

Germany . 22 parts In-Stock

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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ComSIT USA

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Inventory MP

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North Shore Components

USA . 8 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,216 parts In-Stock

1+ parts

$0.720

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2,216

$0.720

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Continental Prestige Electronics

USA . 5,205 parts In-Stock

1+ parts

$1.966

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$1.927

5,205

$1.966

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$1.927

Argo Parts USA

USA . 1,920 parts In-Stock

1+ parts

$1.966

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1,920

$1.966

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Netroflash

USA . 500 parts In-Stock

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$1.966

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$1.927

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500

$1.966

$1.927

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Corohmni

South Africa . 103 parts In-Stock

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$2.202

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103

$2.202

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Semicontronic

India . 185 parts In-Stock

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$2.220

100+ parts

$2.164

1k+ parts

$2.153

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185

$2.220

$2.164

$2.153

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$2.220

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50

$2.220

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Corphita

USA . 1,442 parts In-Stock

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$2.349

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1,442

$2.349

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AZTECH Wire

Italy . 362 parts In-Stock

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$8.347

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362

$8.347

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GreenTree Electronics

Israel . 79,350 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 11,050 parts In-Stock

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Perfect Parts

USA . 8,568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Problanco Electronics

Mexico . 6,697 parts In-Stock

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SupplyDigital Components

Austria . 5,995 parts In-Stock

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TANS Electronics

Latvia . 5,615 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,865 parts In-Stock

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Kulean Microsystems

USA . 4,502 parts In-Stock

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Metaverse IC Inc.

Canada . 2,912 parts In-Stock

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Supply Digital

USA . 2,035 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,085 parts In-Stock

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Futuretech Components

Singapore . 468 parts In-Stock

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468

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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Assy Fe

Spain . 70 parts In-Stock

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Overview

Unleash the power of the HGTG12N60A4D by Onsemi, a top-notch Insulated Gate Bipolar Transistor (IGBT) designed for high-performance power control applications. With a single configuration and built-in diode, this transistor offers unmatched efficiency and reliability. Manufactured by Onsemi, known for their superior quality and innovation, this IGBT guarantees optimal performance and durability. Experience seamless operation and maximum power dissipation with a maximum VCEsat of 2.7V and a collector-emitter voltage of 600V. Upgrade your power control systems with the HGTG12N60A4D and witness unparalleled results that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance compared to P-channel transistors.

Maximum VCEsat: 2.7 V

Low VCEsat helps in reducing power losses and increasing efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for various power control applications.

Maximum Collector-Emitter Voltage: 600 V

Suitable for high-voltage applications, providing ample safety margin.

Maximum Power Dissipation (Abs): 167 W

Can handle high power levels without overheating.

Nominal Turn On Time (ton): 33 ns

Fast turn on time allows for quick response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTG12N60A4D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

95 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGTG12N60A4D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-622-1676, 5961016221676

NIIN

016221676

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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