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FF450R12KE4EHOSA1

Infineon Technologies

FF450R12KE4EHOSA1 by Infineon Technologies

FF450R12KE4EHOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 elements and built-in diode. It has a max collector-emitter voltage of 1200V, collector current of 520A, and turn-off time of 800ns. Ideal for power control applications, this transistor operates at temperatures as low as -40°C and is UL approved.

Median Price

$155.158

Lifecycle Status

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11

In-Stock Inventory

1k+

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DigiKey

USA . 15 parts In-Stock

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$130.780

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15

$130.780

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Newark

USA . 18 parts In-Stock

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$142.330

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18

$142.330

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Chip1Stop

Japan . 10 parts In-Stock

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$151.000

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10

$151.000

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Verical

USA . 10 parts In-Stock

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$159.316

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10

$159.316

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Farnell

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$167.330

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$167.330

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Element14

Singapore . 11 parts In-Stock

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$299.170

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$299.170

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RS (Exports)

UK . 5 parts In-Stock

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$309.235

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$237.866

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$309.235

$237.866

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Rochester

USA . 8 parts In-Stock

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$113.750

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$101.780

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$95.790

8

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$113.750

$101.780

$95.790

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Digiode

USA . 820 parts In-Stock

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$127.357

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820

$127.357

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Nova Conductors

Japan . 500 parts In-Stock

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$255.260

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500

$255.260

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Vyrian

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Modulus Dynamics

Lithuania . 3,581 parts In-Stock

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$0.674

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$0.647

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$0.620

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3,581

$0.674

$0.647

$0.620

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AZTECH Wire

Italy . 226 parts In-Stock

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$9.039

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Ampacity Inc.

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$113.900

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$113.900

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Corphita

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$120.654

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960

$120.654

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Continental Prestige Electronics

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$144.280

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Component Stockers USA

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$203.790

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57

$203.790

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Netroflash

USA . 100 parts In-Stock

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$255.260

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$250.155

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100

$255.260

$250.155

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Microchip USA

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$320.040

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3,437

$320.040

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,658 parts In-Stock

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2,658

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Overview

Discover the Infineon Technologies FF450R12KE4EHOSA1, a high-quality Insulated Gate Bipolar Transistor designed for power control applications. With a maximum collector-emitter voltage of 1200V and a nominal turn-on time of 325ns, this N-channel transistor provides reliable performance in a compact rectangular package. Infineon Technologies, known for its industry-leading products, ensures that customers receive top-notch quality and value with this transistor. Experience the benefits of efficient power control and superior performance with the FF450R12KE4EHOSA1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making them ideal for power control applications.

Configuration: COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN DIODE

The common emitter configuration allows for high power amplification, while the built-in diode provides protection against reverse current flow, enhancing the reliability of the device.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high power handling and efficient switching, making it a reliable choice for controlling electrical power.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage rating, this IGBT can handle high voltage applications with ease, ensuring stable operation under varying load conditions.

Maximum Collector Current (IC): 520 A

The high collector current rating enables this IGBT to handle high power levels, making it suitable for heavy-duty power control applications where high current levels are required.

Nominal Turn Off Time (toff): 800 ns

The fast turn-off time of 800 ns ensures efficient switching performance, reducing switching losses and improving overall efficiency of the power control system.

Nominal Turn On Time (ton): 325 ns

With a fast turn-on time of 325 ns, this IGBT can quickly transition from the off state to the on state, enabling rapid response in power control applications.

Reference Standard: UL APPROVED

Being UL approved ensures that this IGBT meets strict safety and performance standards set by Underwriters Laboratories, providing confidence in the reliability and safety of the device.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12KE4EHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

800 ns

Nominal Turn On Time (ton):

325 ns

Trade Compliance

FF450R12KE4EHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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