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FF450R17ME4PB11BOSA1

Infineon Technologies

FF450R17ME4PB11BOSA1 by Infineon Technologies

Infineon Technologies' FF450R17ME4PB11BOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. Ideal for POWER CONTROL applications, it has a max voltage of 1700V, current of 600A, and turn-off time of 1600ns. With a package style of FLANGE MOUNT and operating temp up to 175°C, it offers efficient performance in various power control systems.

Median Price

$157.782

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

$145.090

100+ parts

$136.380

1k+ parts

$127.680

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22

$145.090

$136.380

$127.680

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DigiKey

USA . 22 parts In-Stock

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22

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Verical

USA . 16 parts In-Stock

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$170.475

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$159.600

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16

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$170.475

$159.600

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Distributors (In-Stock)

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Digiode

USA . 304 parts In-Stock

1+ parts

$184.670

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304

$184.670

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Nova Conductors

Japan . 87 parts In-Stock

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$274.938

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87

$274.938

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Vyrian

USA . 6,929 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 306 parts In-Stock

1+ parts

$1.690

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306

$1.690

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AZTECH Wire

Italy . 463 parts In-Stock

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$17.786

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463

$17.786

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$165.230

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10

$165.230

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Semicontronic

India . 10 parts In-Stock

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$165.230

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$161.099

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$160.273

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10

$165.230

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$160.273

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Corphita

USA . 999 parts In-Stock

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$174.951

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$174.951

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Aranea Global

USA . 500 parts In-Stock

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$269.439

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$258.661

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500

$269.439

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$258.661

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Continental Prestige Electronics

USA . 6,623 parts In-Stock

1+ parts

$274.938

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$269.439

6,623

$274.938

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$269.439

Modulus Dynamics

Lithuania . 11,197 parts In-Stock

1+ parts

$325.159

100+ parts

$312.153

1k+ parts

$299.146

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11,197

$325.159

$312.153

$299.146

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Corohmni

South Africa . 16 parts In-Stock

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$325.159

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16

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Microchip USA

USA . 7,005 parts In-Stock

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$439.905

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7,005

$439.905

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QUARKTWIN TECHNOLOGY LTD

USA . 10,650 parts In-Stock

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Argo Parts USA

USA . 3,474 parts In-Stock

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Overview

Unleash the power of your applications with the FF450R17ME4PB11BOSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-quality products that guarantee high performance and reliability. This Insulated Gate Bipolar Transistor (IGBT) boasts a N-CHANNEL polarity, SERIES CONNECTED configuration, and is perfect for POWER CONTROL applications. With its built-in diode and thermistor, this transistor offers unmatched convenience and efficiency. Elevate your projects with the FF450R17ME4PB11BOSA1 and experience seamless operation like never before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically offer lower on-state voltage drop and higher current carrying capacity, making them suitable for high power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for efficient power control and management, providing built-in protection against overvoltage and thermal issues.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in managing high power levels.

Maximum Collector Current (IC): 600 A

With a high maximum collector current rating, this IGBT can handle large currents without risk of damage or overheating, making it suitable for high-power industrial applications.

Nominal Turn On Time (ton): 380 ns

The fast turn-on time allows for quick switching speeds, enabling efficient power control and minimizing energy loss in high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R17ME4PB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1600 ns

Nominal Turn On Time (ton):

380 ns

Trade Compliance

FF450R17ME4PB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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