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FF450R12KE4HOSA1

Infineon Technologies

FF450R12KE4HOSA1 by Infineon Technologies

Infineon's FF450R12KE4HOSA1 IGBT features N-CHANNEL polarity, 2 elements with diode in series configuration. With VCEsat of 2.15V and IC of 520A, it suits high-power applications like motor drives and renewable energy systems. Operating at up to 150°C, it offers fast turn-off time (toff) of 800ns for efficient power control.

Median Price

$147.058

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 63 parts In-Stock

1+ parts

$130.780

100+ parts

-

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63

$130.780

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Newark

USA . 24 parts In-Stock

1+ parts

$142.330

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-

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24

$142.330

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Arrow

USA . 18 parts In-Stock

1+ parts

$151.787

100+ parts

-

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18

$151.787

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Verical

USA . 18 parts In-Stock

1+ parts

$151.787

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18

$151.787

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Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$155.000

100+ parts

$144.000

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12

$155.000

$144.000

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Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$113.750

1k+ parts

$101.780

10k+ parts

$95.790

20

-

$113.750

$101.780

$95.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 753 parts In-Stock

1+ parts

$128.877

100+ parts

-

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753

$128.877

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$237.886

100+ parts

-

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50

$237.886

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-

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Galco

USA . 10 parts In-Stock

1+ parts

$265.240

100+ parts

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10

$265.240

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Vyrian

USA . 4,814 parts In-Stock

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4,814

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Distributors (Availability)

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Corohmni

South Africa . 765 parts In-Stock

1+ parts

$1.389

100+ parts

-

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765

$1.389

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Modulus Dynamics

Lithuania . 25,527 parts In-Stock

1+ parts

$1.627

100+ parts

$1.562

1k+ parts

$1.497

10k+ parts

-

25,527

$1.627

$1.562

$1.497

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AZTECH Wire

Italy . 330 parts In-Stock

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$9.106

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330

$9.106

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Ampacity Inc.

Singapore . 153 parts In-Stock

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$115.310

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153

$115.310

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Semicontronic

India . 9 parts In-Stock

1+ parts

$116.230

100+ parts

$113.324

1k+ parts

$112.743

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-

9

$116.230

$113.324

$112.743

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Corphita

USA . 970 parts In-Stock

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$122.094

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970

$122.094

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Aranea Global

USA . 100 parts In-Stock

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$233.128

100+ parts

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1k+ parts

$223.803

10k+ parts

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100

$233.128

-

$223.803

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Continental Prestige Electronics

USA . 2,533 parts In-Stock

1+ parts

$235.660

100+ parts

-

1k+ parts

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10k+ parts

$230.947

2,533

$235.660

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-

$230.947

QUARKTWIN TECHNOLOGY LTD

USA . 16,177 parts In-Stock

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16,177

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Microchip USA

USA . 10,895 parts In-Stock

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10,895

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,722 parts In-Stock

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1,722

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Robosynatics

Brazil . 1,068 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.841

10k+ parts

$1.841

1,068

-

$1.880

$1.841

$1.841

Lucentia Tech

USA . 1,068 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.841

10k+ parts

$1.841

1,068

-

$1.880

$1.841

$1.841

Overview

Unlock the power of cutting-edge technology with the FF450R12KE4HOSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers unrivaled quality and reliability, making this Insulated Gate Bipolar Transistor (IGBT) an ideal choice for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 520A, this N-CHANNEL IGBT offers exceptional performance and efficiency. Whether you're looking to optimize your renewable energy systems or enhance your industrial processes, the FF450R12KE4HOSA1 provides unmatched value, benefits, and advantages that will propel your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Allows for efficient operation in high power applications.

Configuration:

SERIES CONNECTED, CENTER TAP - Provides a reliable and stable connection for power distribution.

Maximum VCEsat:

2.15 V - Low saturation voltage helps in reducing power losses.

Package Shape:

RECTANGULAR - Easy to mount and fits well in various electronic circuits.

No. of Elements:

2 - Increases power handling capacity and reliability.

Nominal Turn Off Time (toff):

800 ns - Enables quick switching for enhanced performance.

No. of Terminals:

7 - Sufficient terminals for connecting various components.

Maximum Power Dissipation (Abs):

2400 W - Capable of handling high power levels effectively.

Package Style (Meter):

FLANGE MOUNT - Provides sturdy mounting and heat dissipation.

Maximum Operating Temperature:

150 °C - Allows for operation in high temperature environments.

Maximum Collector-Emitter Voltage:

1200 V - Suitable for high voltage applications.

Transistor Element Material:

SILICON - Offers high reliability and performance.

Maximum Gate-Emitter Voltage:

20 V - Secure gate triggering for consistent operation.

Maximum Collector Current (IC):

520 A - High current handling capability for demanding applications.

Terminal Position:

UPPER - Easy access to terminals for connection purposes.

Case Connection:

ISOLATED - Provides electrical isolation for added safety.

Nominal Turn On Time (ton):

325 ns - Ensures quick turn-on response for efficient operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12KE4HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

800 ns

Nominal Turn On Time (ton):

325 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FF450R12KE4HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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