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IRG4PC30UPBF

Infineon Technologies

IRG4PC30UPBF by Infineon Technologies

IRG4PC30UPBF by Infineon is an N-CHANNEL IGBT with 600V VCE, 23A IC, and 100W Ptot. Ideal for POWER CONTROL applications due to its fast switching times (ton: 33ns, toff: 320ns) and high operating temperature of 150°C. Package style is FLANGE MOUNT with THROUGH-HOLE terminals.

Median Price

$1.343

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$1.343

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-

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63

$1.343

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ComSIT Distribution GmbH

Germany . 3,450 parts In-Stock

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3,450

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ComSIT USA

USA . 3,450 parts In-Stock

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3,450

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Chip Stock

USA . 725 parts In-Stock

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725

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Vyrian

USA . 615 parts In-Stock

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615

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Digiode

USA . 509 parts In-Stock

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509

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Distributors (Availability)

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Corohmni

South Africa . 45 parts In-Stock

1+ parts

$0.381

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-

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45

$0.381

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Modulus Dynamics

Lithuania . 14,369 parts In-Stock

1+ parts

$0.586

100+ parts

$0.563

1k+ parts

$0.539

10k+ parts

-

14,369

$0.586

$0.563

$0.539

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Continental Prestige Electronics

USA . 5,930 parts In-Stock

1+ parts

$1.343

100+ parts

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10k+ parts

$1.316

5,930

$1.343

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$1.316

Argo Parts USA

USA . 3,961 parts In-Stock

1+ parts

$1.343

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3,961

$1.343

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.343

100+ parts

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$1.276

10k+ parts

$1.249

2,000

$1.343

-

$1.276

$1.249

Aztec Data Supply Inc.

USA . 4,515 parts In-Stock

1+ parts

$1.600

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4,515

$1.600

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AZTECH Wire

Italy . 262 parts In-Stock

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$19.574

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262

$19.574

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Ampacity Inc.

Singapore . 597 parts In-Stock

1+ parts

$25.050

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597

$25.050

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Semicontronic

India . 328 parts In-Stock

1+ parts

$43.050

100+ parts

$41.974

1k+ parts

$41.758

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328

$43.050

$41.974

$41.758

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Perfect Parts

USA . 9,072 parts In-Stock

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9,072

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Corphita

USA . 531 parts In-Stock

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531

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Microchip USA

USA . 290 parts In-Stock

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290

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Infinite Electronics LLP (Excess)

. 207 parts In-Stock

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207

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GreenTree Electronics

Israel . 175 parts In-Stock

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175

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Unleash the power of cutting-edge technology with the IRG4PC30UPBF by Infineon Technologies. As a leader in the industry, Infineon offers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With its N-CHANNEL configuration and high-performance capabilities, this transistor provides unmatched reliability and efficiency. Say goodbye to downtime and hello to seamless operations with the IRG4PC30UPBF. Upgrade your systems today and experience the difference Infineon can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and thermal stability, making this IGBT a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient and high-performance power control, making this IGBT suitable for power electronics applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and installation process, making this IGBT easy to integrate into different systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT ensures precise and reliable operation in power management systems.

Package Shape: RECTANGULAR

The rectangular shape of the package offers space-saving benefits and easy mounting options, making this IGBT ideal for compact designs.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure and stable connections, ensuring efficient power transfer in various operating conditions.

Maximum Fall Time (tf): 150 ns

The fast fall time of 150ns enhances switching performance and reduces power loss, making this IGBT efficient in power control applications.

Nominal Turn Off Time (toff): 320 ns

The nominal turn off time of 320ns ensures quick turn-off capabilities, improving overall system efficiency and performance.

No. of Terminals: 3

With 3 terminals, this IGBT offers simple and straightforward connectivity, making it user-friendly and easy to install.

Maximum Power Dissipation (Abs): 100 W

The high maximum power dissipation of 100W allows for reliable operation under heavy load conditions, making this IGBT suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC30UPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

150 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

33 ns

Trade Compliance

IRG4PC30UPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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