Loading...

FF600R12ME4EB11BOSA1

Infineon Technologies

FF600R12ME4EB11BOSA1 by Infineon Technologies

Infineon's FF600R12ME4EB11BOSA1 is a N-CHANNEL IGBT with 2 elements, diode, and thermistor. It has VCEsat of 2.1V, toff of 700ns, and VCEmax of 1200V. Ideal for power control applications due to its common emitter configuration and max operating temp of 150°C.

Median Price

$248.080

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 7 parts In-Stock

1+ parts

$184.000

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$184.000

-

-

-

Rochester

USA . 1,337 parts In-Stock

1+ parts

$200.070

100+ parts

$188.070

1k+ parts

$176.060

10k+ parts

-

1,337

$200.070

$188.070

$176.060

-

Newark

USA . 7 parts In-Stock

1+ parts

$248.080

100+ parts

$232.790

1k+ parts

-

10k+ parts

-

7

$248.080

$232.790

-

-

Element14

Singapore . 7 parts In-Stock

1+ parts

$370.740

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$370.740

-

-

-

DigiKey

USA . 5 parts In-Stock

1+ parts

$442.910

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$442.910

-

-

-

Verical

USA . 958 parts In-Stock

1+ parts

-

100+ parts

$235.088

1k+ parts

$220.075

10k+ parts

-

958

-

$235.088

$220.075

-

RS (Exports)

UK . 46 parts In-Stock

1+ parts

-

100+ parts

$2,057.383

1k+ parts

-

10k+ parts

-

46

-

$2,057.383

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TodayComponents

USA . 100 parts In-Stock

1+ parts

$217.060

100+ parts

$196.210

1k+ parts

-

10k+ parts

-

100

$217.060

$196.210

-

-

Digiode

USA . 312 parts In-Stock

1+ parts

$221.236

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$221.236

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$240.470

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$240.470

-

-

-

Vyrian

USA . 909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

909

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 776 parts In-Stock

1+ parts

$1.091

100+ parts

$1.047

1k+ parts

$1.004

10k+ parts

-

776

$1.091

$1.047

$1.004

-

Corohmni

South Africa . 364 parts In-Stock

1+ parts

$1.331

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$1.331

-

-

-

Aztec Data Supply Inc.

USA . 29,705 parts In-Stock

1+ parts

$1.909

100+ parts

-

1k+ parts

-

10k+ parts

-

29,705

$1.909

-

-

-

Semicontronic

India . 703 parts In-Stock

1+ parts

$197.950

100+ parts

$193.001

1k+ parts

$192.012

10k+ parts

-

703

$197.950

$193.001

$192.012

-

Ampacity Inc.

Singapore . 604 parts In-Stock

1+ parts

$197.950

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$197.950

-

-

-

Corphita

USA . 29 parts In-Stock

1+ parts

$209.592

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$209.592

-

-

-

Component Stockers USA

USA . 1,358 parts In-Stock

1+ parts

$235.530

100+ parts

$225.140

1k+ parts

$203.580

10k+ parts

-

1,358

$235.530

$225.140

$203.580

-

Continental Prestige Electronics

USA . 5,368 parts In-Stock

1+ parts

$238.090

100+ parts

-

1k+ parts

-

10k+ parts

$233.328

5,368

$238.090

-

-

$233.328

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$240.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$240.470

-

-

-

Microchip USA

USA . 5,234 parts In-Stock

1+ parts

$357.135

100+ parts

-

1k+ parts

-

10k+ parts

-

5,234

$357.135

-

-

-

Argo Parts USA

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,917

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Perfect Parts

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Overview

Elevate your power control capabilities with the FF600R12ME4EB11BOSA1 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this N-CHANNEL configuration with built-in diode and thermistor. Ideal for a wide range of applications, this transistor offers reliable performance, efficient power control, and exceptional durability. Enhance your projects with the value and benefits that only Infineon can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity allows for efficient power control and high switching speeds.

Configuration: COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Common emitter configuration with built-in diode and thermistor provides convenience and reliability in power control applications.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates minimal power loss and high efficiency in operation.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for usage in high voltage applications.

Nominal Turn Off Time (toff): 700 ns

Fast nominal turn off time ensures quick switching and response in power control operations.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance enables reliability in various thermal conditions.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage allows for effective gate control and stability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance supports usage in a wide range of environments.

Nominal Turn On Time (ton): 340 ns

Fast nominal turn on time ensures quick activation and response in power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12ME4EB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.35 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X13

No. of Elements:

2

No. of Terminals:

13

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

700 ns

Nominal Turn On Time (ton):

340 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FF600R12ME4EB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19