Loading...

FF600R17ME4PB11BOSA1

Infineon Technologies

FF600R17ME4PB11BOSA1 by Infineon Technologies

Infineon Technologies' FF600R17ME4PB11BOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. It has a max voltage of 1700V and max current of 950A for POWER CONTROL applications. Featuring a toff of 980ns and ton of 320ns, this rectangular package transistor is ideal for high-power systems.

Median Price

$194.730

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1 parts In-Stock

1+ parts

$105.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$105.280

-

-

-

Rochester

USA . 15 parts In-Stock

1+ parts

$179.060

100+ parts

$168.320

1k+ parts

$157.570

10k+ parts

-

15

$179.060

$168.320

$157.570

-

DigiKey

USA . 21 parts In-Stock

1+ parts

$223.830

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$223.830

-

-

-

Verical

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$210.400

1k+ parts

$196.963

10k+ parts

-

9

-

$210.400

$196.963

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 154 parts In-Stock

1+ parts

$100.016

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$100.016

-

-

-

DigiKey Marketplace

USA . 15 parts In-Stock

1+ parts

$404.410

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$404.410

-

-

-

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$475.932

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$475.932

-

-

-

Vyrian

USA . 8,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,618

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$18.049

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$18.049

-

-

-

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$89.490

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$89.490

-

-

-

Corphita

USA . 70 parts In-Stock

1+ parts

$94.752

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$94.752

-

-

-

Component Stockers USA

USA . 23 parts In-Stock

1+ parts

$102.000

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$102.000

-

-

-

Modulus Dynamics

Lithuania . 20,134 parts In-Stock

1+ parts

$302.934

100+ parts

$290.817

1k+ parts

$278.699

10k+ parts

-

20,134

$302.934

$290.817

$278.699

-

Continental Prestige Electronics

USA . 2,302 parts In-Stock

1+ parts

$443.223

100+ parts

-

1k+ parts

-

10k+ parts

$434.359

2,302

$443.223

-

-

$434.359

Argo Parts USA

USA . 779 parts In-Stock

1+ parts

$443.223

100+ parts

$438.791

1k+ parts

$434.359

10k+ parts

$429.926

779

$443.223

$438.791

$434.359

$429.926

Microchip USA

USA . 6,521 parts In-Stock

1+ parts

$559.905

100+ parts

-

1k+ parts

-

10k+ parts

-

6,521

$559.905

-

-

-

Overview

Experience the power of Infineon Technologies with the FF600R17ME4PB11BOSA1 Insulated Gate Bipolar Transistor. This N-CHANNEL transistor offers top-notch quality and reliability for your power control needs. With a maximum collector current of 950 A and a nominal turn-off time of 980 ns, this transistor is perfect for applications requiring high performance. Trust in Infineon's expertise to deliver exceptional value and benefits to your projects, ensuring smooth operation and efficiency. Elevate your power control systems with the FF600R17ME4PB11BOSA1 from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-CHANNEL IGBTs, making them suitable for high-power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for better control and protection in power control applications, improving overall performance and reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable operation in controlling high-power electrical systems.

No. of Elements: 2

Having 2 elements allows for enhanced switching capabilities and higher power handling capacity in the device.

Maximum Collector-Emitter Voltage: 1700 V

With a high maximum voltage rating, this IGBT can handle high voltage applications with ease, providing durability and reliability in demanding scenarios.

Maximum Collector Current (IC): 950 A

Capable of handling high collector currents, making it suitable for applications requiring high power output and control.

Nominal Turn Off Time (toff): 980 ns

The fast turn off time allows for quick switching and efficient power control, reducing energy losses and improving overall performance.

Nominal Turn On Time (ton): 320 ns

The fast turn on time ensures quick response and efficient operation in power control applications, enhancing system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R17ME4PB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

980 ns

Nominal Turn On Time (ton):

320 ns

Trade Compliance

FF600R17ME4PB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19