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IRG7PH42UD1PBF

Infineon Technologies

IRG7PH42UD1PBF by Infineon Technologies

IRG7PH42UD1PBF by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max gate-emitter voltage of 30V. It has a power dissipation of 313W, making it suitable for power control applications requiring high voltage handling and efficient switching capabilities. With a fall time of 43ns and turn-off time of 460ns, this transistor is ideal for applications where fast switching speeds are crucial.

Median Price

$7.885

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$4.671

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Voyager Components

USA . 264 parts In-Stock

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$11.098

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$11.098

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$11.098

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$11.098

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$11.098

Digiode

USA . 398 parts In-Stock

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ComSIT Distribution GmbH

Germany . 349 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

USA . 50 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 345 parts In-Stock

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$1.930

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Modulus Dynamics

Lithuania . 269 parts In-Stock

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$4.671

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$4.484

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$4.297

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Corohmni

South Africa . 187 parts In-Stock

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Continental Prestige Electronics

USA . 1,800 parts In-Stock

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$4.578

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AZTECH Wire

Italy . 750 parts In-Stock

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$7.173

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Ampacity Inc.

Singapore . 1,638 parts In-Stock

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$10.050

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Semicontronic

India . 981 parts In-Stock

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$14.050

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$13.699

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$13.628

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Argo Parts USA

USA . 1,465 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Overview

Unleash the power of Infineon Technologies' IRG7PH42UD1PBF Insulated Gate Bipolar Transistor! With its high-quality construction and efficient design, this N-CHANNEL transistor is perfect for power control applications. Whether you're looking to optimize energy efficiency or enhance performance, this single configuration with a built-in diode offers unmatched value and benefits. Trust in Infineon Technologies to provide reliable solutions that deliver results. Upgrade your electronics with the IRG7PH42UD1PBF today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good electrical insulation and protection for the internal components of the IGBT, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and switching capabilities in electronic circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, making it suitable for a wide range of industrial and consumer electronic products.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltage operations, making it ideal for use in power electronics applications.

Maximum Power Dissipation (Abs): 313 W

High power dissipation capability ensures the IGBT can handle heavy loads without overheating.

Maximum Collecto Current (IC): 78 A

High collector current rating allows for efficient power handling capabilities in electronic circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG7PH42UD1PBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

43 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

460 ns

Trade Compliance

IRG7PH42UD1PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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