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IRG7PH42UD-EP

Infineon Technologies

IRG7PH42UD-EP by Infineon Technologies

IRG7PH42UD-EP by Infineon is an N-channel IGBT with 1200V max collector-emitter voltage and 85A max collector current. It has a single configuration with built-in diode, ideal for power control applications. Featuring a max power dissipation of 320W and operating temperature of 150°C, it offers fast switching times of 41ns rise, 86ns fall, and 444ns turn-off.

Median Price

$5.010

Lifecycle Status

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8

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1k+

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Rochester

USA . 323 parts In-Stock

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$5.010

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$4.910

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$4.810

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323

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Digiode

USA . 279 parts In-Stock

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$4.760

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Chip Stock

USA . 3,800 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 125 parts In-Stock

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Nova Conductors

Japan . 47 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.465

100+ parts

$0.423

1k+ parts

$0.381

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270

$0.465

$0.423

$0.381

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Modulus Dynamics

Lithuania . 22,997 parts In-Stock

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$0.638

100+ parts

$0.612

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$0.587

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22,997

$0.638

$0.612

$0.587

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Aztec Data Supply Inc.

USA . 1,234 parts In-Stock

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$1.759

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$4.260

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Corphita

USA . 735 parts In-Stock

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$4.509

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$4.509

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AZTECH Wire

Italy . 321 parts In-Stock

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$7.801

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Semicontronic

India . 323 parts In-Stock

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$9.270

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$9.038

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$8.992

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$9.270

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Continental Prestige Electronics

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RC Electronics

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,634 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Kepictronics

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the IRG7PH42UD-EP from Infineon Technologies. As a leader in the industry, Infineon ensures top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). Perfect for power control applications, this N-channel transistor boasts a built-in diode and impressive performance metrics. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 85A, this product delivers exceptional power dissipation of up to 320W. Experience seamless operation and enhanced efficiency with the IRG7PH42UD-EP, your ultimate solution for high-performance power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the product is resistant to wear and tear, making it a reliable choice for long-term use.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient power control and high performance, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and improves efficiency, making it a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is a perfect choice for controlling high-power devices effectively.

Maximum Rise Time (tr): 41 ns

The fast rise time ensures quick switching speeds, making this IGBT ideal for applications requiring rapid response times.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation, making it a user-friendly option.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections, ensuring stable performance and ease of installation.

Maximum Fall Time (tf): 86 ns

The quick fall time prevents delays in switching off, improving overall efficiency and performance.

Nominal Turn Off Time (toff): 444 ns

This IGBT offers a precise turn-off time, ensuring accurate control and reliability in power management applications.

No. of Terminals: 3

The three terminals provide flexibility in circuit design and connectivity options, making it suitable for a variety of applications.

Maximum Power Dissipation (Abs): 320 W

With a high power dissipation capacity, this IGBT can handle heavy loads without overheating, ensuring reliable operation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and heat dissipation, enhancing the overall performance and longevity of the product.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures the IGBT can withstand demanding conditions, making it suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high collector-emitter voltage rating, this IGBT can handle high voltage levels, making it suitable for power control in various systems.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides reliability and durability, making this IGBT a long-lasting solution for power control applications.

Maximum Gate-Emitter Voltage: 30 V

The high gate-emitter voltage rating ensures stable operation and protection against voltage spikes, enhancing the overall performance and longevity of the product.

Maximum Collector Current (IC): 85 A

With a high collector current rating, this IGBT can handle high current loads, making it suitable for power control applications with demanding requirements.

Maximum Gate-Emitter Threshold Voltage: 6 V

The low gate-emitter threshold voltage allows for precise control and efficient operation, making this IGBT ideal for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and wiring, providing ease of use and convenience in circuit design.

Case Connection: COLLECTOR

The collector case connection ensures efficient heat dissipation and secure mounting, enhancing the overall performance and reliability of the product.

Nominal Turn On Time (ton): 51 ns

The quick turn-on time ensures rapid response and precise control, making this IGBT suitable for applications requiring fast switching speeds.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG7PH42UD-EP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

86 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

41 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

444 ns

Nominal Turn On Time (ton):

51 ns

Trade Compliance

IRG7PH42UD-EP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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