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IRG7PH42UD2PBF

Infineon Technologies

IRG7PH42UD2PBF by Infineon Technologies

IRG7PH42UD2PBF by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max gate-emitter voltage of 30V. It is designed for power control applications and has a max power dissipation of 321W.

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Vyrian

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Digiode

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Aztec Data Supply Inc.

USA . 1,271 parts In-Stock

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Modulus Dynamics

Lithuania . 8,434 parts In-Stock

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$1.122

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$1.077

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$1.032

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Corohmni

South Africa . 69 parts In-Stock

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Semicontronic

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$11.749

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$11.688

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AZTECH Wire

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Corphita

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Overview

Discover the power and reliability of the IRG7PH42UD2PBF by Infineon Technologies. As a leader in the industry, Infineon Technologies brings you a top-quality Insulated Gate Bipolar Transistor (IGBT) that is perfect for power control applications. With its single configuration and built-in diode, this IGBT offers unmatched convenience and efficiency. The rectangular package shape and through-hole terminal form make installation a breeze. Experience maximum power dissipation of 321 W and a maximum collector-emitter voltage of 1200 V, ensuring exceptional performance in any project. Trust Infineon Technologies for superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent electrical insulation and mechanical protection, making it suitable for a wide range of applications in various environments.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient current flow and low on-resistance, making this IGBT ideal for high-power applications requiring fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for an external diode, improving overall system efficiency and reducing costs.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT delivers high-performance and precise control over the flow of electrical power.

Package Shape: RECTANGULAR

The rectangular package shape provides easy and secure mounting, ensuring proper thermal management and electrical connections.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for convenient and reliable soldering, making it suitable for applications requiring strong and durable connections.

No. of Elements: 1

With a single element, this IGBT offers a straightforward and compact design, simplifying circuit layouts and reducing overall system complexity.

Maximum Fall Time (tf): 85 ns

The fast fall time enables precise switching, allowing for efficient power control and reducing the risk of thermal and electrical stress on the device.

Nominal Turn Off Time (toff): 470 ns

The nominal turn-off time ensures smooth and reliable switching operations, minimizing power losses and enhancing system performance.

No. of Terminals: 3

With three terminals, this IGBT provides easy and flexible connections, accommodating a wide range of circuit configurations.

Maximum Power Dissipation (Abs): 321 W

The high maximum power dissipation capability allows this IGBT to handle large power loads effectively, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mechanical mounting and efficient heat dissipation, maintaining optimal operating conditions for the device.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can withstand high-temperature environments, ensuring reliable performance under challenging conditions.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating allows this IGBT to handle high voltage levels, making it versatile and suitable for various power applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures excellent electrical conductivity and thermal stability, providing reliable and efficient performance.

Maximum Gate-Emitter Voltage: 30 V

With a maximum gate-emitter voltage of 30 volts, this IGBT allows for precise and reliable control over the switching operations.

Maximum Collector Current (IC): 60 A

The high maximum collector current rating enables this IGBT to handle large current loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

The maximum gate-emitter threshold voltage ensures accurate triggering and control of the IGBT, enhancing overall system performance and reliability.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish provides excellent corrosion resistance and reliable solderability, ensuring long-term durability in various operating conditions.

Terminal Position: SINGLE

With a single terminal position, this IGBT allows for simplified and streamlined connections, reducing complexity in circuit design and assembly.

Case Connection: COLLECTOR

The collector case connection enhances thermal management by allowing direct heat dissipation, enabling efficient operation and prolonging the device's lifespan.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG7PH42UD2PBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

85 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

470 ns

Trade Compliance

IRG7PH42UD2PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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