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IRG7PH50K10D-EPBF

Infineon Technologies

IRG7PH50K10D-EPBF by Infineon Technologies

IRG7PH50K10D-EPBF by Infineon Technologies is an N-CHANNEL IGBT with tr of 80ns, tf of 110ns, and Pdiss of 400W. It operates at a max Vce of 1200V and max IC of 90A, suitable for high-power applications in industrial electronics and motor control systems.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,608 parts In-Stock

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-

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$5.760

1k+ parts

$5.150

10k+ parts

$4.850

9,608

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$5.760

$5.150

$4.850

DigiKey

USA . 9,608 parts In-Stock

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9,608

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Verical

USA . 9,608 parts In-Stock

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$7.200

1k+ parts

$6.438

10k+ parts

$6.063

9,608

-

$7.200

$6.438

$6.063

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.932

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100

$5.932

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Digiode

USA . 754 parts In-Stock

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$6.099

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754

$6.099

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DigiKey Marketplace

USA . 9,698 parts In-Stock

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9,698

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Vyrian

USA . 9,596 parts In-Stock

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9,596

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ComSIT Distribution GmbH

Germany . 125 parts In-Stock

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ComSIT USA

USA . 75 parts In-Stock

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75

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,597 parts In-Stock

1+ parts

$1.063

100+ parts

$1.020

1k+ parts

$0.978

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-

3,597

$1.063

$1.020

$0.978

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Corohmni

South Africa . 428 parts In-Stock

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$1.336

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428

$1.336

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Aztec Data Supply Inc.

USA . 978 parts In-Stock

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$1.906

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Ampacity Inc.

Singapore . 9,223 parts In-Stock

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$5.460

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$5.460

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Corphita

USA . 290 parts In-Stock

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$5.778

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290

$5.778

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Continental Prestige Electronics

USA . 4,838 parts In-Stock

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$5.932

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$5.814

4,838

$5.932

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$5.814

Netroflash

USA . 500 parts In-Stock

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$5.932

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500

$5.932

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Component Stockers USA

USA . 14,078 parts In-Stock

1+ parts

$6.620

100+ parts

$6.220

1k+ parts

$5.630

10k+ parts

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14,078

$6.620

$6.220

$5.630

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Microchip USA

USA . 2,023 parts In-Stock

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$17.248

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2,023

$17.248

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Argo Parts USA

USA . 1,920 parts In-Stock

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1,920

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Overview

Unleash the power of innovation with the IRG7PH50K10D-EPBF by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors that are designed for maximum performance and reliability. Ideal for a wide range of applications, this N-CHANNEL IGBT offers unparalleled value and benefits to customers. Say goodbye to inefficiency and hello to superior power management with the IRG7PH50K10D-EPBF. Elevate your projects to new heights with the trusted quality and advanced technology of Infineon Technologies.

Feature Benefit Bullets

Maximum Rise Time (tr): 80 ns

The fast rise time allows for rapid switching of the transistor, making it suitable for high-speed applications.

Maximum Fall Time (tf): 110 ns

The fast fall time ensures quick turn-off of the transistor, reducing power losses and increasing efficiency.

Maximum Power Dissipation (Abs): 400 W

With a high power dissipation rating, this IGBT can handle heavy loads and high power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for reliable performance in challenging environments.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating makes this IGBT suitable for applications requiring high voltage switching.

Maximum Gate-Emitter Voltage: 30 V

The gate-emitter voltage rating ensures compatibility with standard control circuits and ensures reliable operation.

Maximum Collector Current (IC): 90 A

With a high collector current rating, this IGBT can handle large current flows, making it suitable for power electronics applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

The low gate-emitter threshold voltage allows for easy control of the transistor, ensuring precise switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG7PH50K10D-EPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

110 ns

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

30 V

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

80 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Trade Compliance

IRG7PH50K10D-EPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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