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IRG7PH42UD1-EP

Infineon Technologies

IRG7PH42UD1-EP by Infineon Technologies

IRG7PH42UD1-EP by Infineon Technologies is an N-channel insulated gate bipolar transistor (IGBT) with a max collector-emitter voltage of 1200V. It has a max power dissipation of 313W and is designed for power control applications. The transistor has a rectangular package shape and a through-hole terminal form.

Median Price

$3.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34 parts In-Stock

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$3.910

100+ parts

$3.830

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$3.750

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34

$3.910

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$3.750

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Distributors (In-Stock)

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Digiode

USA . 790 parts In-Stock

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$3.714

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790

$3.714

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 34 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.411

100+ parts

$0.374

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$0.337

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60

$0.411

$0.374

$0.337

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Aztec Data Supply Inc.

USA . 1,951 parts In-Stock

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$0.646

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$0.646

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Corohmni

South Africa . 1,044 parts In-Stock

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$1.097

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$1.097

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Modulus Dynamics

Lithuania . 22,571 parts In-Stock

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$1.279

100+ parts

$1.228

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$1.177

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22,571

$1.279

$1.228

$1.177

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$3.320

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34

$3.320

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Semicontronic

India . 34 parts In-Stock

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$3.320

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$3.237

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$3.220

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Corphita

USA . 208 parts In-Stock

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$3.519

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AZTECH Wire

Italy . 472 parts In-Stock

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$7.998

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Component Stockers USA

USA . 684 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,894 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,929 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 585 parts In-Stock

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Microchip USA

USA . 354 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Discover the power of the IRG7PH42UD1-EP by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor (IGBT) that is revolutionizing power control applications. With its single configuration and built-in diode, this product offers unparalleled efficiency and reliability. Whether you need to regulate power in industrial machinery or optimize energy consumption in renewable energy systems, the IRG7PH42UD1-EP is the ultimate solution. Experience the benefits of its fast fall time, nominal turn-off time, and high maximum power dissipation. Trust Infineon Technologies for cutting-edge technology that delivers superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the IGBT, making it resistant to temperature variations and physical stress.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient current conduction and low losses, making this IGBT suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for an external diode. This configuration enhances the efficiency and reliability of power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is capable of handling high voltages, making it ideal for use in various power control systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and integration within different systems and equipment.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies soldering and improves stability, ensuring secure connections in various PCB applications.

No. of Elements: 1

With a single element, this IGBT provides a compact and efficient solution for power control applications.

Maximum Fall Time (tf): 43 ns

The low fall time of 43 ns ensures rapid switching capability, improving the overall efficiency and performance in power control operations.

Nominal Turn Off Time (toff): 460 ns

The nominal turn off time of 460 ns contributes to smooth and efficient switching, reducing the chances of power losses and improving system reliability.

No. of Terminals: 3

With three terminals, this IGBT offers easy integration into electrical circuits and ensures reliable connections for power control applications.

Maximum Power Dissipation (Abs): 313 W

The high maximum power dissipation capability of 313 W enables this IGBT to handle high power loads without the risk of overheating or failure.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure and efficient mounting, allowing for better heat dissipation and enhanced overall system performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures the IGBT's reliability and performance in demanding and high-temperature environments.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage rating of 1200 V, this IGBT can handle high voltage applications, providing a safe and reliable power control solution.

Transistor Element Material: SILICON

Made of silicon, the transistor element material ensures efficient power conduction, low losses, and stability, making it an excellent choice for power control applications.

Maximum Gate-Emitter Voltage: 30 V

The maximum gate-emitter voltage of 30 V ensures reliable and precise control of the IGBT, enhancing its suitability for various power control systems.

Maximum Collector Current (IC): 78 A

The maximum collector current rating of 78 A allows this IGBT to handle high current loads with ease, making it an optimal choice for power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

The maximum gate-emitter threshold voltage of 6 V ensures precise control and efficient switching of the IGBT, contributing to improved performance and reliability.

Terminal Finish: MATTE TIN OVER NICKEL

With a matte tin over nickel terminal finish, this IGBT offers excellent solderability and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, providing ease of use and facilitating integration into various circuits and systems.

Case Connection: COLLECTOR

The case connection to the collector enhances thermal dissipation, improving the IGBT's ability to handle high power loads while maintaining low junction temperature.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG7PH42UD1-EP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

43 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

460 ns

Trade Compliance

IRG7PH42UD1-EP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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