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IRG4BC30UDPBF

Infineon Technologies

IRG4BC30UDPBF by Infineon Technologies

IRG4BC30UDPBF by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 23A max collector current. It has a built-in diode, 130ns fall time, and 300ns turn off time. Ideal for power control applications with a max power dissipation of 100W in a rectangular package shape.

Median Price

$4.201

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 75 parts In-Stock

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$4.201

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Digiode

USA . 854 parts In-Stock

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854

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Vyrian

USA . 358 parts In-Stock

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Connect4Technologies Inc.

Canada . 74 parts In-Stock

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ComSIT Distribution GmbH

Germany . 16 parts In-Stock

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Benley Electronics

USA . 5 parts In-Stock

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$0.750

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5

$0.750

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Modulus Dynamics

Lithuania . 19,278 parts In-Stock

1+ parts

$0.980

100+ parts

$0.941

1k+ parts

$0.902

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19,278

$0.980

$0.941

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.517

100+ parts

$1.380

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$1.244

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50

$1.517

$1.380

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Argo Parts USA

USA . 3,213 parts In-Stock

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$4.201

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Continental Prestige Electronics

USA . 527 parts In-Stock

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$4.201

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$4.116

527

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Bastille Electronics

Australia . 107 parts In-Stock

1+ parts

$4.201

100+ parts

$3.991

1k+ parts

$3.791

10k+ parts

$3.739

107

$4.201

$3.991

$3.791

$3.739

AZTECH Wire

Italy . 319 parts In-Stock

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$18.846

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319

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Ampacity Inc.

Singapore . 661 parts In-Stock

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$32.050

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Perfect Parts

USA . 24,304 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,499 parts In-Stock

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Lixinc

USA . 5,301 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,666 parts In-Stock

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Kepictronics

USA . 2,009 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 742 parts In-Stock

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Assy Fe

Spain . 130 parts In-Stock

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Overview

Unlock the power of advanced technology with the IRG4BC30UDPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that excel in power control applications. With a single design and built-in diode, this transistor offers unparalleled efficiency and performance. Whether you're looking to optimize your power systems or enhance your electronic devices, the IRG4BC30UDPBF provides the reliability and precision you need. Experience the difference with Infineon's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower conduction losses and higher efficiency compared to P-Channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in reducing reverse recovery losses and improves the overall efficiency of the power control system.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power levels.

Maximum Fall Time (tf): 130 ns

The fast fall time helps in quick switching operations, reducing switching losses and improving overall performance.

Maximum Power Dissipation (Abs): 100 W

With a high power dissipation capability, this IGBT can handle high power levels efficiently, making it reliable for power control applications.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage allows for operation in high voltage applications without the risk of breakdown, providing reliability and safety.

Maximum Collector Current (IC): 23 A

With a high collector current rating, this IGBT can handle large current flows, making it suitable for high power applications.

Nominal Turn On Time (ton): 62 ns

The fast turn-on time ensures quick activation of the IGBT, reducing switching losses and improving efficiency in power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

130 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

300 ns

Nominal Turn On Time (ton):

62 ns

Trade Compliance

IRG4BC30UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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