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FP15R12KT3BOSA1

Infineon Technologies

FP15R12KT3BOSA1 by Infineon Technologies

FP15R12KT3BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 25A. It has a nominal turn-off time of 610ns and is commonly used in applications requiring high power switching, such as motor drives and inverters.

Median Price

$50.772

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$43.980

1k+ parts

$39.350

10k+ parts

$37.030

12

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$43.980

$39.350

$37.030

DigiKey

USA . 12 parts In-Stock

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12

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Verical

USA . 10 parts In-Stock

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$57.563

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$52.050

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10

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$57.563

$52.050

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 878 parts In-Stock

1+ parts

$46.540

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878

$46.540

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$70.540

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50

$70.540

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Vyrian

USA . 2,598 parts In-Stock

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2,598

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DigiKey Marketplace

USA . 18 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 519 parts In-Stock

1+ parts

$0.755

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-

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519

$0.755

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Modulus Dynamics

Lithuania . 8,763 parts In-Stock

1+ parts

$1.234

100+ parts

$1.185

1k+ parts

$1.135

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-

8,763

$1.234

$1.185

$1.135

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Aztec Data Supply Inc.

USA . 163 parts In-Stock

1+ parts

$1.320

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$1.320

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AZTECH Wire

Italy . 217 parts In-Stock

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$14.289

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$14.289

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Ampacity Inc.

Singapore . 13 parts In-Stock

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$41.640

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13

$41.640

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Semicontronic

India . 13 parts In-Stock

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$41.640

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$40.599

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$40.391

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13

$41.640

$40.599

$40.391

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Corphita

USA . 542 parts In-Stock

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$44.091

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Component Stockers USA

USA . 15 parts In-Stock

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$50.630

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$50.630

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Netroflash

USA . 1,000 parts In-Stock

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$70.540

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$70.540

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Continental Prestige Electronics

USA . 275 parts In-Stock

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$70.540

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$69.129

275

$70.540

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$69.129

QUARKTWIN TECHNOLOGY LTD

USA . 14,803 parts In-Stock

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14,803

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Microchip USA

USA . 6,329 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,256 parts In-Stock

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1,256

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Overview

Experience unrivaled performance and reliability with the FP15R12KT3BOSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies has crafted this insulated gate bipolar transistor (IGBT) to exceed all expectations. Whether you're looking to power industrial machinery or tackle renewable energy solutions, this product offers exceptional value and benefits. With its N-CHANNEL polarity, complex configuration, and 7 elements, this IGBT delivers optimized performance while ensuring ease of installation with its rectangular package shape. Trust in Infineon Technologies and elevate your projects to new heights with the FP15R12KT3BOSA1.

Feature Benefit Bullets

N-CHANNEL Configuration:

This insulated gate bipolar transistor (IGBT) features an N-channel configuration, enhancing its power and efficiency.

Rectangular Package Shape:

Designed in a rectangular shape, this IGBT offers a compact and space-saving solution for various applications.

7 Elements:

With seven elements, this IGBT provides enhanced performance and reliability, ensuring robust operation in demanding environments.

610 ns Nominal Turn Off Time (toff):

The IGBT's fast turn off time of 610 ns facilitates efficient switching and helps reduce power dissipation, improving overall system efficiency.

24 Terminals:

Equipped with 24 terminals, this IGBT allows for versatile connectivity options, enabling seamless integration into a wide range of circuits.

Flange Mount Package Style (Meter):

The flange mount package style of this IGBT simplifies the installation process and enhances thermal dissipation, ensuring optimal performance under high power conditions.

Maximum Operating Temperature: 150°C:

With a maximum operating temperature of 150°C, this IGBT can withstand harsh operating conditions, delivering reliable performance in demanding environments.

Maximum Collector-Emitter Voltage: 1200 V:

The IGBT's high maximum collector-emitter voltage of 1200 V enables it to handle high voltage applications, expanding its range of usability.

Silicon Transistor Element Material:

The silicon transistor element material used in this IGBT enhances its durability and efficiency, making it a reliable choice for extended lifespan and improved performance.

Maximum Collector Current (IC): 25 A:

With a maximum collector current of 25 A, this IGBT can handle high-current applications, providing ample power for demanding industrial processes.

Upper Terminal Position:

The upper terminal position of this IGBT simplifies circuit design and facilitates easier integration, ensuring hassle-free installation for users.

Isolated Case Connection:

The isolated case connection of this IGBT ensures better safety and electrical isolation, minimizing the risk of short circuits and enhancing overall system reliability.

140 ns Nominal Turn On Time (ton):

Featuring a nominal turn on time of 140 ns, this IGBT enables swift and efficient switching, reducing power losses and improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP15R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Trade Compliance

FP15R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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