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FF450R12ME4PB11BOSA1

Infineon Technologies

FF450R12ME4PB11BOSA1 by Infineon Technologies

FF450R12ME4PB11BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, a built-in diode, and thermistor. It has a max voltage of 1200V, max current of 675A, and turn-off time of 740ns. Ideal for applications requiring high power switching in industrial settings due to its robust design and fast switching capabilities.

Median Price

$144.930

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 22 parts In-Stock

1+ parts

$144.930

100+ parts

$128.423

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22

$144.930

$128.423

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EBV Elektronik

Germany . 36 parts In-Stock

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-

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36

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Distributors (In-Stock)

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Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$271.700

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91

$271.700

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NAC Semi

USA . 30 parts In-Stock

1+ parts

$384.070

100+ parts

$349.160

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30

$384.070

$349.160

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Vyrian

USA . 3,097 parts In-Stock

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3,097

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Digiode

USA . 205 parts In-Stock

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205

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Distributors (Availability)

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Corohmni

South Africa . 65 parts In-Stock

1+ parts

$0.910

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65

$0.910

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Modulus Dynamics

Lithuania . 25,469 parts In-Stock

1+ parts

$1.815

100+ parts

$1.742

1k+ parts

$1.670

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-

25,469

$1.815

$1.742

$1.670

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Aztec Data Supply Inc.

USA . 875 parts In-Stock

1+ parts

$1.877

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875

$1.877

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Ampacity Inc.

Singapore . 1,313 parts In-Stock

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$2.050

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1,313

$2.050

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Semicontronic

India . 1,519 parts In-Stock

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$5.050

100+ parts

$4.924

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$4.898

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1,519

$5.050

$4.924

$4.898

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AZTECH Wire

Italy . 747 parts In-Stock

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$6.525

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747

$6.525

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Aranea Global

USA . 500 parts In-Stock

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$266.266

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$255.615

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500

$266.266

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$255.615

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Continental Prestige Electronics

USA . 2,087 parts In-Stock

1+ parts

$271.700

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$266.266

2,087

$271.700

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$266.266

Microchip USA

USA . 9,888 parts In-Stock

1+ parts

$359.580

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9,888

$359.580

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Argo Parts USA

USA . 1,469 parts In-Stock

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1,469

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Corphita

USA . 572 parts In-Stock

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572

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Overview

Experience superior performance and reliability with the FF450R12ME4PB11BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and innovation in their Insulated Gate Bipolar Transistors (IGBT) like this N-CHANNEL device. With its series connected configuration, built-in diode, and thermistor, this product is perfect for applications requiring high voltage and current capabilities. Trust in the value and benefits that this IGBT offers, providing customers with efficiency, durability, and optimal performance for their projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance and faster switching speeds compared to P-channel IGBTs, making them suitable for high power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for more efficient power handling and thermal management, resulting in improved reliability and performance.

Package Shape: RECTANGULAR

Rectangular packages are more compact and offer better thermal performance compared to other shapes, making them suitable for applications where space is limited.

Nominal Turn Off Time (toff): 740 ns

The fast turn-off time allows for efficient switching and reduces power losses, making the product suitable for high frequency applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for operation in harsh environments, increasing the product's versatility and reliability.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating allows for use in high voltage applications, making the product suitable for a wide range of power electronics applications.

Transistor Element Material: SILICON

Silicon IGBTs offer good thermal conductivity and switching characteristics, making them ideal for high power applications where efficiency is important.

Maximum Collector Current (IC): 675 A

The high collector current rating allows for handling of large amounts of power, making the product suitable for high power applications.

Nominal Turn On Time (ton): 290 ns

The fast turn-on time enables quick response in switching applications, improving overall efficiency and performance of the product.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12ME4PB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

740 ns

Nominal Turn On Time (ton):

290 ns

Trade Compliance

FF450R12ME4PB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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