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FF450R17ME4PBOSA1

Infineon Technologies

FF450R17ME4PBOSA1 by Infineon Technologies

FF450R17ME4PBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, a built-in diode and thermistor. It is used for POWER CONTROL applications, with a max operating temperature of 175°C and a max collector-emitter voltage of 1700V.

Median Price

$157.782

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 328 parts In-Stock

1+ parts

$145.090

100+ parts

$136.380

1k+ parts

$127.680

10k+ parts

-

328

$145.090

$136.380

$127.680

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Verical

USA . 328 parts In-Stock

1+ parts

-

100+ parts

$170.475

1k+ parts

$159.600

10k+ parts

-

328

-

$170.475

$159.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 659 parts In-Stock

1+ parts

$184.642

100+ parts

-

1k+ parts

-

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659

$184.642

-

-

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Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$379.431

100+ parts

-

1k+ parts

-

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69

$379.431

-

-

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Vyrian

USA . 4,447 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,447

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 281 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

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-

281

$0.890

-

-

-

Advanced Electronics

New Zealand . 99 parts In-Stock

1+ parts

$1.292

100+ parts

$1.176

1k+ parts

$1.059

10k+ parts

-

99

$1.292

$1.176

$1.059

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$10.022

100+ parts

-

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-

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513

$10.022

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Ampacity Inc.

Singapore . 168 parts In-Stock

1+ parts

$165.210

100+ parts

-

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-

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168

$165.210

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-

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Semicontronic

India . 131 parts In-Stock

1+ parts

$165.210

100+ parts

$161.080

1k+ parts

$160.254

10k+ parts

-

131

$165.210

$161.080

$160.254

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Corphita

USA . 807 parts In-Stock

1+ parts

$174.924

100+ parts

-

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807

$174.924

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-

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Modulus Dynamics

Lithuania . 14,042 parts In-Stock

1+ parts

$325.159

100+ parts

$312.153

1k+ parts

$299.146

10k+ parts

-

14,042

$325.159

$312.153

$299.146

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$325.159

100+ parts

-

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78

$325.159

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Continental Prestige Electronics

USA . 5,949 parts In-Stock

1+ parts

$379.431

100+ parts

-

1k+ parts

-

10k+ parts

$371.842

5,949

$379.431

-

-

$371.842

Argo Parts USA

USA . 1,153 parts In-Stock

1+ parts

$379.431

100+ parts

$375.637

1k+ parts

$371.842

10k+ parts

$368.048

1,153

$379.431

$375.637

$371.842

$368.048

Netroflash

USA . 500 parts In-Stock

1+ parts

$379.431

100+ parts

-

1k+ parts

$360.459

10k+ parts

$352.871

500

$379.431

-

$360.459

$352.871

Microchip USA

USA . 3,996 parts In-Stock

1+ parts

$577.395

100+ parts

-

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10k+ parts

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3,996

$577.395

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

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Overview

Experience the power of the FF450R17ME4PBOSA1 by Infineon Technologies, a high-quality insulated gate bipolar transistor (IGBT) that guarantees reliable and efficient power control. With its N-CHANNEL polarity and series connected configuration, this product is designed to deliver exceptional performance in a wide range of applications. Its rectangular package shape and flange mount style ensure easy installation and optimal heat dissipation. Boasting a maximum collector-emitter voltage of 1700V and a maximum collector current of 600A, this IGBT provides unmatched power handling capabilities. Trust Infineon Technologies for all your power control needs and unlock new possibilities today.

Feature Benefit Bullets

Polarity or Channel Type:

This specification indicates that the transistor operates as a N-channel IGBT, allowing for efficient power control.

Configuration:

The series connected configuration with a center tap, along with the built-in diode and thermistor, offers enhanced performance and protection in power control applications.

Transistor Application:

With its specific application in power control, this product provides reliable and accurate control over electrical power, ensuring optimal performance and efficiency.

Package Shape:

The rectangular package shape enables easy installation and compatibility with standard electronic components, facilitating integration into various systems.

No. of Elements:

This product features two elements, which increases its capability to handle higher power loads and improves overall performance.

Nominal Turn Off Time (toff):

The nominal turn-off time of 1600 ns ensures fast switching off of the transistor, reducing power dissipation and enhancing efficiency.

No. of Terminals:

With 11 terminals, this IGBT offers versatile connection options and allows for greater flexibility in circuit design and configuration.

Package Style (Meter):

The flange mount package style provides mechanical stability and enables convenient mounting on heat sinks or other supporting structures, ensuring efficient heat dissipation.

Maximum Operating Temperature:

The high maximum operating temperature of 175°C allows for reliable operation even in demanding environments, preventing overheating and ensuring long-term durability.

Maximum Collector-Emitter Voltage:

The maximum collector-emitter voltage of 1700 V enables this IGBT to handle high-voltage applications, making it suitable for various power control scenarios.

Transistor Element Material:

Utilizing silicon as the transistor element material offers excellent electrical characteristics, reliability, and thermal performance, making this product a reliable choice for power control applications.

Maximum Collector Current (IC):

With a maximum collector current of 600 A, this IGBT is capable of handling high power levels, providing efficient power control for various industrial and electronic systems.

Terminal Position:

The upper terminal position simplifies connections and makes it easier to integrate the IGBT into existing circuits or equipment.

Case Connection:

The isolated case connection helps to prevent unwanted electrical interactions, ensuring proper functioning and minimizing the risk of damage to other components.

Nominal Turn On Time (ton):

The nominal turn-on time of 380 ns ensures fast switching on of the transistor, enabling precise control of the power flow and enhancing overall system responsiveness.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R17ME4PBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1600 ns

Nominal Turn On Time (ton):

380 ns

Trade Compliance

FF450R17ME4PBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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