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FF450R33T3E3B5BPSA1

Infineon Technologies

FF450R33T3E3B5BPSA1 by Infineon Technologies

FF450R33T3E3B5BPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a Max VCEsat of 2.75V and can handle a Max Collector Current of 450A. Ideal for POWER CONTROL applications, this IGBT operates b/w -40 to 150°C, with a Max Collector-Emitter Voltage of 3300V.

Median Price

$1,294.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$1,294.030

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Verical

USA . 1 parts In-Stock

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$1,294.030

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$1,294.030

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Chip1Stop

Japan . 1 parts In-Stock

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$1,366.830

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$1,366.830

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Distributors (In-Stock)

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Digiode

USA . 267 parts In-Stock

1+ parts

$1,172.427

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Vyrian

USA . 3,324 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Modulus Dynamics

Lithuania . 1,747 parts In-Stock

1+ parts

$0.480

100+ parts

$0.461

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$0.442

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1,747

$0.480

$0.461

$0.442

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Corohmni

South Africa . 590 parts In-Stock

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$0.602

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$0.602

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$1,049.010

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Corphita

USA . 330 parts In-Stock

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$1,110.721

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$1,110.721

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Component Stockers USA

USA . 7 parts In-Stock

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$1,374.540

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Microchip USA

USA . 3,257 parts In-Stock

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$1,471.370

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$1,601.000

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Argo Parts USA

USA . 204 parts In-Stock

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Aranea Global

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Overview

Unleash the power of cutting-edge technology with the Infineon Technologies FF450R33T3E3B5BPSA1 Insulated Gate Bipolar Transistor (IGBT). Engineered with precision and expertise, this N-channel transistor offers unparalleled performance in power control applications. With a maximum collector-emitter voltage of 3300V and a maximum collector current of 450A, this transistor is designed to handle high-power requirements with ease. Say goodbye to inefficiency and hello to reliability with the FF450R33T3E3B5BPSA1 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower on-state voltage drop and higher switching speed, making them more efficient for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more flexible and efficient power control capabilities, with built-in protection from reverse voltage.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and reliability in high-power systems.

Maximum VCEsat: 2.75 V

Low VCEsat helps reduce power losses and improve overall efficiency of the device.

Maximum Collector-Emitter Voltage: 3300 V

High voltage rating allows for use in high power applications without the risk of breakdown or damage.

Maximum Collector Current (IC): 450 A

High collector current rating enables the device to handle large amounts of power, suitable for heavy duty industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the device can function reliably in varying environmental conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R33T3E3B5BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

3300 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PUFM-X10

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

2190 ns

Nominal Turn On Time (ton):

710 ns

Maximum VCEsat:

2.75 V

Trade Compliance

FF450R33T3E3B5BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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