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FGH40N65UFDTU_F085

Onsemi

FGH40N65UFDTU_F085 by Onsemi

FGH40N65UFDTU_F085 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.4V, IC of 80A, and Pmax of 290W. Ideal for power control applications, it operates up to 150°C with a VCE max of 650V.

Median Price

$2.868

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 300 parts In-Stock

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$3.025

10k+ parts

$2.850

300

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$3.025

$2.850

Rochester

USA . 300 parts In-Stock

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-

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$2.710

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$2.420

10k+ parts

$2.280

300

-

$2.710

$2.420

$2.280

Distributors (In-Stock)

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Nova Conductors

Japan . 119 parts In-Stock

1+ parts

$2.311

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$2.311

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Digiode

USA . 3,468 parts In-Stock

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Vyrian

USA . 588 parts In-Stock

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588

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Corohmni

South Africa . 439 parts In-Stock

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$2.265

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439

$2.265

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Continental Prestige Electronics

USA . 5,542 parts In-Stock

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$2.311

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$2.265

5,542

$2.311

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$2.265

Argo Parts USA

USA . 2,250 parts In-Stock

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$2.311

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2,250

$2.311

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Netroflash

USA . 1,050 parts In-Stock

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$2.311

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$2.265

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1,050

$2.311

$2.265

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Ampacity Inc.

Singapore . 624 parts In-Stock

1+ parts

$7.050

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624

$7.050

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AZTECH Wire

Italy . 1,603 parts In-Stock

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$9.890

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$9.890

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Component Stockers USA

USA . 714 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

USA . 10,643 parts In-Stock

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Problanco Electronics

Mexico . 9,315 parts In-Stock

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TANS Electronics

Latvia . 8,862 parts In-Stock

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SupplyDigital Components

Austria . 8,190 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,600 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 1,235 parts In-Stock

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Overview

Discover the FGH40N65UFDTU_F085 by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor that ensures superior performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor with built-in diode is ideal for power control applications. With a maximum VCEsat of 2.4V and a maximum operating temperature of 150°C, this transistor offers unparalleled efficiency and durability. Experience seamless power management with the FGH40N65UFDTU_F085 and unlock a world of possibilities in your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this IGBT lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

Being an N-channel IGBT allows for easy integration into various power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies the overall design of power control circuits and reduces component count.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum VCEsat: 2.4 V

With a low VCEsat, this IGBT offers high efficiency and reduced power losses during operation.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of mounting and integration into circuitry.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections and easy soldering during assembly.

Maximum Fall Time (tf): 60 ns

The quick fall time ensures fast switching speeds, making this IGBT suitable for high-frequency applications.

Nominal Turn Off Time (toff): 203 ns

The turn-off time of 203 ns allows for precise control and regulation of the power flow.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and enhances the overall ease of use.

Maximum Power Dissipation (Abs): 290 W

With a high power dissipation capability, this IGBT can handle heavy loads without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting in various applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this IGBT can withstand harsh environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating provides a wide range of potential applications for this IGBT.

Transistor Element Material: SILICON

Silicon offers high reliability and efficiency, making this IGBT a durable and long-lasting choice.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures reliable and consistent performance during operation.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this IGBT can function in cold environments without issues.

Maximum Collector Current (IC): 80 A

The high collector current rating allows for handling of large currents, making this IGBT suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

With a low gate-emitter threshold voltage, this IGBT enables easy and efficient gate control.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection procedures.

Case Connection: COLLECTOR

The case connection at the collector enhances thermal dissipation and ensures efficient heat management.

Nominal Turn On Time (ton): 60 ns

The quick turn-on time of 60 ns allows for fast and precise power control.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high quality and reliability for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N65UFDTU_F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Fall Time (tf):

60 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

203 ns

Nominal Turn On Time (ton):

60 ns

Maximum VCEsat:

2.4 V

Trade Compliance

FGH40N65UFDTU_F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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