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FGH40N60SMD

Onsemi

FGH40N60SMD by Onsemi

FGH40N60SMD by Onsemi is an N-CHANNEL IGBT with 600V VCE, 80A IC, and 349W Ptot. Ideal for power control applications due to its fast tr of 28ns and tf of 17ns. It comes in a FLANGE MOUNT package with through-hole terminals.

Median Price

$5.000

Lifecycle Status

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26

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1k+

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Newark

USA . 10,057 parts In-Stock

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$2.270

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$2.270

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$2.270

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$2.270

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Arrow

USA . 63,318 parts In-Stock

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$3.745

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$2.175

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Farnell

UK . 877 parts In-Stock

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$4.590

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$2.400

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$2.140

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$4.590

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Mouser Electronics

USA . 10,111 parts In-Stock

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$2.500

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DigiKey

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$5.650

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$3.192

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$2.252

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$2.159

1,844

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$3.192

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$2.159

RS (Exports)

UK . 171 parts In-Stock

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$6.253

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$5.185

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Element14

Singapore . 10,053 parts In-Stock

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$5.720

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$4.190

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Chip1Stop

Japan . 290 parts In-Stock

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Verical

USA . 63,318 parts In-Stock

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Master Electronics

USA . 450 parts In-Stock

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$3.180

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EBV Elektronik

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Maritex

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$3.018

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$1.767

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$1.465

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Digiode

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$3.553

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Nova Conductors

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TME

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$3.980

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$2.940

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Chip Stock

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Vyrian

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Flip Electronics

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Cyclops Electronics Ltd

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South Electronics

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IBS Electronics

USA . 450 parts In-Stock

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$4.460

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$3.086

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$2.917

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NAC Semi

USA . 90 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 30 parts In-Stock

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$4.243

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EMSNET

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Prism Electronics

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Aztec Data Supply Inc.

USA . 2,285 parts In-Stock

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$0.725

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$0.725

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.993

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$0.943

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$0.943

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350

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Corohmni

South Africa . 186 parts In-Stock

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Semicontronic

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$3.227

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$3.211

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Corphita

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$3.366

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Continental Prestige Electronics

USA . 2,141 parts In-Stock

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$3.511

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$3.441

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Argo Parts USA

USA . 41 parts In-Stock

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$3.511

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Netroflash

USA . 50 parts In-Stock

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$3.890

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$3.696

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$3.618

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Microchip USA

USA . 7,971 parts In-Stock

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$17.024

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Perfect Parts

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Lixinc

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RC Electronics

USA . 8,345 parts In-Stock

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Futuretech Components

Singapore . 7,500 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Problanco Electronics

Mexico . 6,760 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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S.R.D Solutions

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SupplyDigital Components

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UHIMA Technologies

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iodParts Technologies Inc.

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GreenTree Electronics

Israel . 450 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Robosynatics

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Lucentia Tech

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Overview

Enhance your power control applications with the FGH40N60SMD by Onsemi, a top-quality Insulated Gate Bipolar Transistor that guarantees reliable performance and durability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor offers a single configuration with a built-in diode, making it ideal for a wide range of power control tasks. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 349W, this transistor is designed to handle high-power applications with ease. Trust Onsemi's reputation for excellence and choose the FGH40N60SMD for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and saves space by eliminating the need for an external diode.

Maximum Power Dissipation (Abs): 349 W

High power dissipation capability allows the transistor to handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 600 V

Can withstand high voltage levels, making it ideal for applications that require high voltage switching.

Maximum Collector Current (IC): 80 A

Capable of carrying high current levels, allowing for efficient power control in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60SMD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

17 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

28 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

132 ns

Nominal Turn On Time (ton):

37 ns

Trade Compliance

FGH40N60SMD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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